Flexible Light-Emitting Device Wiring Segmentation

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Solution Overview

Problem

Existing light-emitting devices with embedded LED elements and transparent, flexible wiring face challenges in connecting external devices due to the thinness and fragility of the embedded electrical wiring, making direct electrical connection difficult.

Innovation Solution

A flexible light-emitting device design featuring a light-emitting part with a pair of transparent, flexible insulating substrates and a resin layer, where the internal wiring pattern is formed using ITO or meshed metallic fine wires, and the external wiring is divided into narrower sections connected to the internal wiring using an anisotropic conductive adhesive for reliable electrical contact.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If electrical wiring is embedded in transparent resin to achieve flexibility and transparency, then the wiring becomes thin and flexible, but it becomes difficult to directly connect external devices to the thin wiring

Engineering Contradiction:
Improvetransparency and flexibilityVSAvoidease of connection
Core Design Contradiction:
Object-affected harmful factorsVSEase of operation

Solution Approach 1:

The electrical wiring is divided into two distinct segments: thin embedded wiring for transparency and flexibility, and thick external wiring for easy connection. The thin wiring is embedded in the transparent resin to maintain optical properties, while the thick wiring extends outward to facilitate straightforward connection to external devices, eliminating the need to handle fragile thin wiring for connections.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

A connection structure acts as an intermediary between the thin embedded wiring and external devices. This intermediary component receives connections from external devices and transfers electrical signals to the thin embedded wiring, shielding the fragility of the thin wiring from the connection process while maintaining the transparency and flexibility benefits of the embedded design.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Object-affected harmful factors

If thin wiring is used for embedding to maintain transparency, then flexibility is improved, but reliability of electrical connection deteriorates

Engineering Contradiction:
ImprovetransparencyVSAvoidelectrical connection reliability
Core Design Contradiction:
Object-affected harmful factorsVSReliability

Solution Approach 1:

The wiring system is segmented into thin embedded portions for transparency and thick external portions for reliable connection. The thin wiring maintains optical properties while the thick wiring provides mechanical strength and reliable electrical connection, with each segment optimized for its specific function.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

A robust connection structure serves as an intermediary that ensures reliable electrical connection. This intermediary component provides a stable interface between external devices and the thin embedded wiring, compensating for the fragility of the thin wiring while maintaining the transparency required for the embedded design.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Duration of action of moving object

If thin wiring is embedded in resin, then flexibility is achieved, but the wiring becomes fragile and difficult to handle

Engineering Contradiction:
ImproveflexibilityVSAvoidease of handling
Core Design Contradiction:
Duration of action of moving objectVSEase of operation

Solution Approach 1:

The wiring is segmented into thin embedded sections for flexibility and transparency, and thick external sections for ease of handling. The thin portion maintains optical properties and flexibility, while the thick portion provides mechanical robustness for easy manipulation and connection during installation and use.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

A connection structure acts as an intermediary that handles all manipulation and connection operations. This intermediary component absorbs the mechanical stress of handling and connection activities, protecting the thin embedded wiring from damage while maintaining the flexibility benefits of the embedded design.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enables reliable and flexible electrical connections between the light-emitting part and external devices, enhancing the versatility and ease of attachment of the light-emitting device while maintaining transparency and conductivity.

Implementation Method 1

the internal wiring pattern is bonded, at an end of the insulating substrates, to the end of the external wiring that is divided into a plurality of wirings by an anisotropic conductive adhesive

Methodology Applied
Scientific EffectAnisotropic conductivity: Anisotropy

Data Source

PatentUS10734365B2Light-emitting device
Publication Date: 2020.08.04 NICHIA CORP
  • US10734365B2 patent drawing
  • US10734365B2 patent drawing
  • US10734365B2 patent drawing

AI summary

A light-emitting device according to an embodiment includes a light-emitting part and an external wiring. The light-emitting part includes: a pair of insulating substrates that has light transmissive property and flexibility; a plurality of light-emitting elements arranged between the pair of insulating substrates; an internal wiring pattern that is provided between the pair of insulating substrates, and is connected to the light-emitting elements; and a resin layer that has light transmissive property and insulating property, and is provided between the pair of insulating substrates. An end of the external wiring is divided into a plurality of wirings having a line width that is narrower than a line width of the internal wiring pattern. An end of the internal wiring pattern is bonded, at an end of the insulating substrates, to the end of the external wiring that is divided into a plurality of wirings by an anisotropic conductive adhesive.