Flexible Solid State Light Sheet for Fluorescent Replacement

The patent divides the high-power LED into multiple low-power LED chips (e.g., 10-100 chips per module) that are spatially segmented and arranged in an array. Each chip operates at lower power levels, simplifying individual chip packaging while achieving high total lumen output through the collective emission of multiple chips. This segmentation resolves the contradiction by maintaining high illumination intensity without requiring complex high-power packaging.

The patent implements a nested structure where multiple LED chips are integrated within a single light module or panel. The chips are arranged in arrays and interconnected through conductor patterns on flexible substrates, creating a nested configuration where numerous low-power chips are contained within a compact module that functions as a unified high-output light source. This nesting approach achieves high lumen output while keeping individual chip packaging simple.

By segmenting the total power load across multiple low-power LED chips, each chip generates significantly less heat than a single high-power LED would produce for the same total lumen output. The distributed heat generation allows for more effective thermal management, as heat is spread across multiple smaller sources rather than concentrated in one high-power device.

The patent introduces intermediate heat management structures, including thermally conductive substrates and heat sinks that mediate between the LED chips and the environment. These intermediary thermal pathways efficiently conduct heat away from the chip array, preventing heat accumulation while maintaining the high illumination output generated by multiple chips.

The patent applies local quality by varying the spatial distribution, density, and orientation of individual LED chips across the panel surface. Different regions of the panel can have different chip configurations optimized for their specific illumination requirements. This local customization allows uniform light distribution to be achieved across the entire panel while using cost-effective low-power chips throughout.

The patent utilizes parameter changes by adjusting key variables such as chip spacing, orientation angles, and density gradients across the panel. By optimizing these parameters, the collective emission of many low-power chips produces uniform light distribution. The conductor pattern geometry and phosphor layer thickness are also tuned to enhance light mixing and uniformity, allowing cost-effective multi-chip designs to achieve precision light distribution.

The patent merges multiple individual LED chips into integrated modules or panels where the chips are interconnected through conductor patterns on flexible substrates. This merging creates a unified light-emitting unit that functions as a single device while internally comprising multiple chips. The integration reduces the practical complexity of handling and installing numerous separate components, as the entire chip array can be treated as one modular unit.

The patent implements multi-functionality by designing the LED chip array to serve multiple purposes simultaneously: individual chips provide light emission, the conductor patterns provide both electrical interconnection and thermal pathways, the substrate provides mechanical support and flexibility, and phosphor layers provide color conversion. This multi-functionality reduces the need for separate dedicated components for each function, thereby reducing overall device complexity despite using multiple chips.