Flexible Light Source Structure with Layered Thermal Stability
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Solution Overview
Problem
Conventional LED light sources used in optoelectronic products are not flexible, limiting their application in devices that require adaptability and thinness.
Innovation Solution
A flexible light source structure is manufactured using a supporting substrate, a flexible insulating layer, a conductive circuit layer, light emitting diodes, and a packaging layer, with each layer carefully formed and integrated to ensure mechanical support, thermal stability, and efficient light transmission, allowing for the creation of a thin, double-sided luminous and flexible light source.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional LED light source structure is used, then manufacturing simplicity is maintained, but flexibility and thinness are lost
Solution Approach 1:
The light source structure is divided into multiple functional layers including flexible substrate layer, insulating layer, circuit layer, LED chip layer, and packaging layer. Each layer performs a specific function and can be independently optimized, enabling flexibility while maintaining manufacturing feasibility through modular construction
Solution Approach 2:
The patent employs composite material structure combining flexible substrate (such as flexible PCB), insulating materials, conductive materials, and optical materials. This composite approach achieves both flexibility from the flexible substrate and functional performance from specialized materials in each layer
2Adaptability or versatility
If multiple layers are integrated for flexibility and functionality, then adaptability is improved, but manufacturing precision requirements increase
Solution Approach 1:
The flexible substrate and insulating layers are prepared and positioned in advance before LED chip mounting. Circuit patterns are pre-formed on the flexible substrate, and alignment marks are pre-established to guide subsequent assembly steps, reducing precision requirements during final assembly
Solution Approach 2:
The insulating layer serves as an intermediary between the circuit layer and LED chips, providing both electrical insulation and mechanical positioning. This intermediary layer facilitates precise alignment without requiring direct high-precision bonding between conductive elements and chips
3Stability of the object's composition
If thermal expansion coefficients are matched between layers, then warping is prevented, but material selection complexity increases
Solution Approach 1:
The patent explicitly controls the thermal expansion coefficient parameter of each layer, ensuring it falls within a specific range (10-15×10^-6/K) to match across layers. This parameter optimization prevents differential thermal expansion and warping while maintaining manufacturability through standard material selections
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The flexible light source structure achieves a thin and flexible design suitable for various applications, such as indicator light boxes and backlight modules, while maintaining durability and preventing warping through matching thermal expansion coefficients between layers.
Implementation Method 1
preventing warping through matching thermal expansion coefficients between layers
Data Source
AI summary
The present invention relates to a flexible light source structure. The flexible light source structure includes a flexible insulating layer, a conductive trace layer formed on the flexible insulating layer, a plurality of light emitting diodes formed on the conductive trace layer and a packaging layer. The packaging layer covers the light emitting diodes and filling the gaps between the light emitting diodes.