Flexible Magnet Assembly for Sputtering Film Uniformity
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Solution Overview
Problem
Conventional sputter deposition equipment faces challenges in achieving uniform film deposition due to process phenomena like the 'cross-corner effect' and process drift, leading to variations in deposition rate across the substrate, which cannot be effectively addressed without moving the entire magnet assembly.
Innovation Solution
An adjustable sputter deposition system with a magnet assembly that includes a flexible magnetic control body, allowing for local adjustments to the magnetic field without moving the entire magnet assembly, by bending an elongated flexible magnetic control body to project differently into a gap defined by a magnetic backing plate, thereby compensating for local process conditions and maintaining film uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the entire magnet assembly is moved to adjust process conditions, then film uniformity can be improved, but device complexity and operational difficulty increase
Solution Approach 1:
The magnet assembly is segmented into multiple independent magnet modules arranged in a racetrack configuration. Each module can be independently adjusted to control local magnetic field conditions, allowing precise control of deposition rates across different regions of the substrate without moving the entire assembly.
Solution Approach 2:
The magnet modules are made dynamically adjustable during the deposition process. The ability to move and reposition individual magnet modules enables real-time optimization of magnetic field distribution, allowing the system to adapt to changing process conditions and maintain film uniformity throughout production runs.
2Adaptability or versatility
If the magnet assembly is made locally adjustable, then process conditions can be optimized, but device complexity increases
Solution Approach 1:
The magnet assembly is divided into discrete, independently controllable magnet modules. This segmentation allows local adjustment of magnetic field strength and distribution at specific positions on the target, providing adaptability to address local process variations without requiring complex adjustments of the entire assembly.
Solution Approach 2:
Each magnet module can be positioned to create locally optimized magnetic field conditions. This allows different regions of the target to have tailored magnetic field characteristics, enabling local process optimization for specific areas of the substrate while maintaining overall system simplicity through modular design.
3Device complexity
If conventional magnet assemblies are used, then device simplicity is maintained, but film uniformity deteriorates due to cross-corner effect and process drift
Solution Approach 1:
The magnet modules are designed to be dynamically repositionable during deposition runs. This dynamic capability allows the system to compensate for process drift and maintain optimal magnetic field distribution over time, significantly improving film uniformity compared to static conventional magnet assemblies.
Solution Approach 2:
The system enables changes in magnetic field parameters (strength, distribution, configuration) by adjusting magnet module positions. This parameter control allows optimization of deposition conditions to eliminate cross-corner effects and maintain consistent film quality across the entire substrate surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves exceptional film uniformity by allowing for real-time adjustments to the magnetic field, addressing the 'cross-corner effect' and process drift without the need to move the primary magnets, thus improving the consistency of the deposition process.
Implementation Method 1
The magnet assembly creates a magnetic field comprising field lines that extend from the proximal end of the first magnet, through the sputtering target, along an arc located in front of the sputtering target, back through the sputtering target, to the proximal end of the second permanent magnet, through the second permanent magnet, along a return path, and to the distal end of the first permanent magnet
Implementation Method 2
The elongated flexible magnetic body has a length and is differentially bendable along the length so as to project further into the gap at one position along the length than at another position along the length
Implementation Method 3
Sputter deposition (or 'sputtering') is one method of depositing such coatings
Data Source
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AI summary
The invention provides a sputter deposition assembly that includes a sputtering chamber, a sputtering target, and a magnet assembly. The magnet assembly includes a magnetic backing plate comprising an elongated flexible magnetic control body or a plurality of layered metal sheets.