Flexible Membrane Suction Head for Variable Chip Size Die Bonding
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Solution Overview
Problem
Conventional die bonding tools experience loose adhesion and size mismatch issues, leading to chip attach failures and inability to seamlessly integrate semiconductor chips of varying sizes, resulting in inefficient operations and increased costs.
Innovation Solution
A workpiece displacement system featuring a head with a conduit and recess port, combined with a force distribution member that supplies a negative pressure state, ensuring secure contact and uniform force distribution, allowing for easy reconfiguration to accommodate different chip sizes without modifying the head.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional die bonding tools use a fixed head and suction portion design, then the tool structure is simple, but it cannot accommodate semiconductor chips of varying sizes without re-tool modifications
Solution Approach 1:
The suction portion is designed with a flexible membrane that can dynamically adjust its shape and size to conform to different chip dimensions. This dynamic flexibility allows the same tool head to accommodate various chip sizes without requiring physical retooling, resolving the contradiction between adaptability and device complexity.
Solution Approach 2:
The system changes the physical parameters of the suction portion by varying the negative pressure levels and distribution patterns to adapt to different chip sizes. By adjusting pressure parameters rather than physical structure, the tool achieves versatility while maintaining a fixed head design.
2Reliability
If conventional die bonding tools exert concentrated bonding force, then the bonding action is simple, but it creates uneven force distribution leading to chip attach failure and void formation
Solution Approach 1:
The suction portion applies different local pressures at different regions of the chip surface simultaneously. The membrane conformally contacts the chip and distributes bonding force locally across the entire chip area, preventing concentrated stress points that cause voids and attach failures, while maintaining a relatively simple overall device structure.
Solution Approach 2:
The patent replaces traditional mechanical bonding force application with a pressure-based system using negative pressure through the membrane. This substitution allows for more uniform force distribution across the chip surface without requiring complex mechanical force application mechanisms.
3Strength
If conventional die bonding tools use rigid head and suction portion interfaces, then the manufacturing is simple, but it results in loose adhesion and size mismatch
Solution Approach 1:
The suction portion utilizes a flexible membrane that can conform to different chip geometries while maintaining strong adhesion to the tool head. This flexible film approach provides both strong bonding strength and ease of manufacture, as the membrane can be easily attached and removed without complex manufacturing processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system prevents chip attach failures, reduces vacuum pressure losses, and efficiently handles various chip sizes, enhancing productivity and reducing retooling time while maintaining secure adhesion and avoiding wire touch damage.
Implementation Method 1
supplying a negative pressure state through the head and the force distribution member
Data Source
AI summary
A method of operation of a workpiece displacement system includes: providing a head including a conduit, a recess port, and a channel, the conduit configured such that its major axis intersects the recess port and the channel; inserting a force distribution member into the recess port; and supplying a negative pressure state through the head and the force distribution member.