Flexible Substrate MEMS Sensor for Passive Blast Detection
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Solution Overview
Problem
The integration of MEMS devices with flexible substrates is constrained by manufacturing limitations, hindering their application in detecting and measuring shockwave exposure and blast dosimetry, particularly for traumatic brain injuries, where timely and accurate diagnosis is crucial.
Innovation Solution
A semiconductor device with a MEMS sensor fabricated on a flexible substrate, featuring a conductive base, a sacrificial compartment, and a conductive membrane that permanently shorts with the base upon exposure to a shock threshold, enabling passive blast and shock sensing without a constant power supply, integrated with electronic devices for real-time diagnosis.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If MEMS devices are fabricated on standard substrates like silicon, then manufacturing precision and device reliability are improved, but adaptability to flexible substrates and ease of integration with flexible electronics deteriorate
Solution Approach 1:
The patent changes the substrate parameter from rigid silicon to flexible plastic substrates, enabling MEMS devices to be fabricated on flexible bases while maintaining manufacturing precision through adapted fabrication processes
Solution Approach 2:
The patent employs composite material structures combining flexible plastic substrates with MEMS sensor components, creating a hybrid system that achieves both flexibility and sensing precision
2Measurement precision
If MEMS sensors require constant power supply for operation, then measurement precision and reliability are improved, but ease of operation and applicability in passive sensing scenarios deteriorate
Solution Approach 1:
The MEMS sensor is designed to self-generate electrical charge through piezoelectric effects when subjected to shockwave mechanical stress, eliminating the need for external power supply while maintaining detection precision
Solution Approach 2:
The patent replaces the electrical power supply system with a mechanical energy conversion mechanism, where mechanical shockwave energy is directly converted to electrical signals through piezoelectric materials
3Adaptability or versatility
If flexible substrates are used for MEMS fabrication, then adaptability and ease of integration with flexible electronics are improved, but manufacturing precision and device reliability deteriorate
Solution Approach 1:
The patent modifies fabrication parameters including temperature, pressure, and material selection to accommodate flexible plastic substrates, achieving both flexibility and device reliability through optimized processing conditions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate and cost-effective cumulative blast dose measurement, facilitating better patient care and development of models for traumatic brain injury severity, allowing for immediate field diagnosis of traumatic brain injuries.
Implementation Method 1
configured to permanently short with the base upon exposure to a shock threshold, enabling passive blast and shock sensing
Implementation Method 2
A semiconductor device with a MEMS sensor fabricated on a flexible substrate, featuring a conductive base, a sacrificial compartment, and a conductive membrane that permanently shorts with the base upon exposure to a shock threshold
Data Source
AI summary
Embodiments of embedded MEMS sensors and related methods are described herein. Other embodiments and related methods are also disclosed herein.