Flexible Mesh Circuit Traces for Drapable Soft Goods
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Traditional methods of manufacturing electronic circuitry are insufficiently flexible and drapable, making them unsuitable for integration into soft goods such as clothing and furniture, lacking durability, adaptability, and ease of integration.
Innovation Solution
The development of drapable electronic circuitry layers through mechanical and chemical subtractive manufacturing methods, which involve removing portions of a conductive mesh to form circuit traces, forming electrical connections, and encasing with an insulative layer, allowing for flexibility and integration into various soft goods.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If traditional methods of manufacturing electronic circuitry are used, then circuitry can be produced with standard structural integrity, but the circuitry lacks flexibility and drapability required for soft good integration
Solution Approach 1:
The patent uses a mesh substrate instead of traditional rigid PCB materials, allowing the circuitry to be flexible and drapable while maintaining structural integrity. The mesh structure inherently provides both flexibility and strength, enabling integration into soft goods like clothing and furniture.
Solution Approach 2:
The patent employs composite construction by combining mesh substrate with conductive material coatings and insulative layers. This multi-layer composite structure achieves both the desired flexibility for soft good integration and the structural integrity needed for reliable electrical connections.
2Reliability
If traditional circuitry manufacturing methods are used, then standard electrical connections can be established, but the circuitry lacks durability and washability for soft good applications
Solution Approach 1:
The mesh-based flexible circuitry allows the entire assembly to be washed without rigid components that would be damaged by water exposure or washing machines, significantly improving durability and washability for clothing applications.
Solution Approach 2:
The patent pre-forms the mesh substrate and conductive patterns before integration into the final product, allowing durability testing and validation to occur before integration, thereby reducing integration complexity while ensuring durability requirements are met.
3Shape
If traditional rigid circuit board structures are used, then manufacturing precision can be maintained, but the circuitry cannot achieve low bend radius for conformal integration
Solution Approach 1:
The mesh substrate inherently allows for low bend radius configurations that rigid PCBs cannot achieve, enabling the circuitry to conform to curved surfaces in soft goods while maintaining manufacturing precision through controlled conductive material application on the flexible mesh.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resulting flexible circuitry layers are capable of being integrated into a wide range of soft goods, offering durability, adaptability, and ease of integration while maintaining functionality, with a low bend radius and resistance to stretching.
Implementation Method 1
applying a chemical to the mesh, wherein the chemical is configured to remove at least a portion of the conductive material not covered by the mask layer
Data Source
AI summary
A mechanical subtractive method of manufacturing a flexible circuitry layer may include mechanically removing at least a portion of a conductive mesh, wherein, following the mechanical removal, a remaining portion of the conductive mesh forms at least a portion of a circuitry trace comprising an electrode; forming an electrical connection between the electrode and a terminal of an interfacing component, wherein the interfacing component comprises a connector; and encasing at least a portion of the circuit trace with an insulative layer.