Flexible Metal Laminate with Segmented Polyimide Layers

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Solution Overview

Problem

Flexible metal laminated boards face challenges in achieving a low dielectric constant, high elasticity, and optimized thermal expansion coefficient while maintaining a solid internal structure and high interlayer bonding strength, particularly due to issues with fluorine resin dispersion and adhesion in existing polyimide-based materials.

Innovation Solution

A flexible metal laminate structure comprising a first thermosetting polyimide resin layer with 5-75 wt% fluorine-based resin, a second thermosetting polyimide resin layer with minimal fluorine-based resin, and a thermoplastic polyimide resin layer, where the second thermosetting layer is formed on the first layer and the thermoplastic layer is on the opposite side, ensuring high adhesive strength and preventing delamination at high temperatures.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If fluorine-based resin is dispersed in thermosetting polyimide layer to achieve low dielectric constant, then dielectric constant is reduced, but adhesion to thermoplastic polyimide layer deteriorates

Engineering Contradiction:

Improvedielectric constantVSAvoidadhesion strength

Core Design Contradiction:

Quantity of substanceVSStrength

Solution Approach 1:

The patent divides the polyimide layer into two distinct layers: a first thermosetting polyimide resin layer containing fluorine-based resin (5-75 wt%) for low dielectric constant, and a second thermosetting polyimide resin layer with minimal fluorine-based resin (1 wt% or less) for high adhesion. This segmentation allows each layer to perform its specialized function without compromise.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent applies local quality by creating a gradient in fluorine-based resin concentration across the polyimide layers. The first layer has high fluorine content (5-75 wt%) optimized for dielectric performance, while the second layer has low fluorine content (1 wt% or less) optimized for bonding, with each layer having locally optimized properties for its specific function.

Inventive Principle:

Principle #3Local quality

2Quantity of substance

If fluorine-based resin content is increased to improve dielectric properties, then dielectric constant and dielectric loss factor are reduced, but interlayer bonding strength decreases

Engineering Contradiction:

Improvedielectric loss factorVSAvoidinterlayer bonding strength

Core Design Contradiction:

Quantity of substanceVSStrength

Solution Approach 1:

The patent segments the polyimide structure into two layers with different fluorine-based resin contents. The first layer contains 5-75 wt% fluorine-based resin to achieve low dielectric constant and dielectric loss factor, while the second layer contains 1 wt% or less to ensure strong interlayer bonding with the thermoplastic polyimide layer.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent implements local quality by optimizing fluorine-based resin concentration in different regions: high concentration (5-75 wt%) in the first layer for superior dielectric properties, and low concentration (1 wt% or less) in the second layer for optimal bonding performance.

Inventive Principle:

Principle #3Local quality

3Ease of manufacture

If polyimide layer is used to maintain compatibility with PCB manufacturing process, then manufacturing compatibility is maintained, but dielectric constant remains higher than LCP

Engineering Contradiction:

ImprovePCB manufacturing process compatibilityVSAvoiddielectric constant

Core Design Contradiction:

Ease of manufactureVSQuantity of substance

Solution Approach 1:

The patent creates a composite material system by incorporating fluorine-based resin (5-75 wt%) into the thermosetting polyimide resin layer. This composite structure achieves a dielectric constant of 3.2 or less while maintaining polyimide's compatibility with existing PCB manufacturing processes, avoiding the need to switch to LCP materials.

Inventive Principle:

Principle #40Composite materials

4Ease of operation

If flexible metal laminate structure is optimized for high elasticity, then degree of elasticity is improved, but internal structure solidity may be compromised

Engineering Contradiction:

Improvedegree of elasticityVSAvoidinternal structure solidity

Core Design Contradiction:

Ease of operationVSStability of the object's composition

Solution Approach 1:

The patent employs composite materials by combining thermosetting polyimide resin with fluorine-based resin (5-75 wt%) in the first layer and minimal fluorine-based resin (1 wt% or less) in the second layer. This composite structure achieves high elasticity through the fluorine-based resin content while maintaining internal structure solidity through the thermosetting polyimide matrix and optimized layering.

Inventive Principle:

Principle #40Composite materials

Data Source

PatentUS10226914B2Flexible metal laminate

Publication Date: 2019.03.12 GUANGDONG SHENGYI SCI TECH

AI summary

Disclosed herein is a flexible metal laminate including: a first thermosetting polyimide resin layer containing 5 wt % to 75 wt % of a fluorine-based resin; a second thermosetting polyimide resin layer formed on at least one surface of the first thermosetting polyimide resin layer, and containing 1 wt % or less of the fluorine-based resin; and a thermoplastic polyimide resin layer formed on one surface of the second thermosetting polyimide resin layer so as to face the first thermosetting polyimide resin layer, wherein the first thermosetting polyimide resin layer and the second thermosetting polyimide resin layer include the same thermosetting polyimide resin.