Flexible Micro LED Pixel Package for Color Uniformity and Bending
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Solution Overview
Problem
Conventional pixel packages are passive structures that cannot be independently controlled, have poor color uniformity, and are not easily bent, leading to issues such as large color point shifts and low process yield.
Innovation Solution
An active micro LED pixel package with a flexible redistribution layer and composite laminates, incorporating light-adjusting layers and a control chip, allowing independent control and improved luminous efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional pixel packages use passive structures, then manufacturing is simpler, but independent control capability is lost
Solution Approach 1:
The pixel package transitions from a passive static structure to an active dynamic structure by integrating control chips and conductive structures that enable independent electrical control of each pixel package, allowing it to respond dynamically to control signals while maintaining manufacturability through the transfer head process
2Stability of the object's composition
If conventional pixel packages use rigid structures, then structural stability is maintained, but flexibility and bendability are reduced
Solution Approach 1:
The pixel package incorporates flexible substrates and thin film structures that enable the package to be bent and conform to curved surfaces while maintaining structural integrity and electrical connectivity, achieving both flexibility and structural stability
3Device complexity
If conventional pixel packages lack light-adjusting layers, then device complexity is reduced, but color uniformity and luminous efficiency deteriorate
Solution Approach 1:
Light-adjusting layers are selectively applied to specific pixel packages or regions based on their individual color characteristics, allowing localized correction of color uniformity issues without requiring complex global adjustments, thereby improving color precision while managing device complexity
4Measurement precision
If conventional pixel packages are densely packed, then display resolution is improved, but color point concentration and control precision deteriorate
Solution Approach 1:
Each pixel package is divided into independently controllable units with distinct control chips and conductive structures, allowing precise individual addressing and color adjustment even in densely packed arrangements, maintaining color point concentration while achieving high display resolution
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The pixel package achieves better color point concentration, small color point shift, and higher process yield, with the ability to be easily bent due to its flexible design.
Implementation Method 1
the flexible composite laminate between the LEDs may effectively improve the luminous efficiency of the pixel package and improve the contrast
Implementation Method 2
the pixel package according to the embodiment of the present disclosure converts the light emitted by the LED chip (e.g., the LED chip that emits ultraviolet light) into light having a specific wavelength through the wavelength conversion layer
Data Source
AI summary
A pixel package is provided. The pixel package includes a flexible redistribution layer and a plurality of LED chips arranged on the surface of the flexible redistribution layer in a flip-chip manner. The pixel package also includes a plurality of light-adjusting layers respectively disposed on the LED chips. The pixel package further includes a plurality of flexible composite laminates disposed on the surface of the flexible redistribution layer and between the LED chips.