Flexible Micro-Module Eliminates Smart Card Cavity

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Solution Overview

Problem

Conventional micro-modules for smart cards are limited by the rigidity of integrated circuits, which leads to reliability issues and increased manufacturing costs due to the need for a cavity in the card body, restricting the size and complexity of the ICs that can be used.

Innovation Solution

The integration of ultra-thin flexible Semiconductor-on-Polymer (SoP) ICs eliminates the need for wire bonds and a card cavity, allowing for surface mounting or lamination without a cavity, enabling the use of larger ICs and arrays for enhanced functionality.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If rigid ICs are used in conventional micro-modules, then reliability is improved under normal conditions, but the IC size must be limited to prevent fracture during deformation

Engineering Contradiction:

ImprovereliabilityVSAvoidIC die area

Core Design Contradiction:

ReliabilityVSArea of moving object

Solution Approach 1:

The patent applies flexible thin films by replacing rigid silicon ICs with ultra-thin flexible semiconductor-on-polymer (SoP) ICs that can bend and deform without fracturing. This allows the IC to accommodate the deformation of micro-connectors and card bodies during use, eliminating the reliability-mandated limit on die size while maintaining reliability.

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The patent changes the physical parameters of the IC by transitioning from rigid silicon to flexible semiconductor-on-polymer material, and from thick (700+ microns) to ultra-thin (less than 15 microns) configuration. This parameter change enables the IC to flex without breaking, resolving the contradiction between reliability and size.

Inventive Principle:

Principle #35Parameter changes

2Adaptability or versatility

If larger ICs are used to increase functionality, then device complexity and functionality are improved, but the failure rate increases due to deformation in rigid assemblies

Engineering Contradiction:

ImprovefunctionalityVSAvoidfailure rate

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The flexible SoP ICs can be made larger in area to increase functionality while maintaining reliability because they flex with deformation rather than fracturing. This allows larger ICs and arrays of ICs for large scale memory and processing without the reliability-mandated size limits of rigid ICs.

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The patent uses composite semiconductor-on-polymer structures that combine semiconductor functionality with flexible polymer substrates. This composite material approach enables larger IC areas with enhanced functionality while maintaining reliability through flexibility.

Inventive Principle:

Principle #40Composite materials

3Ease of manufacture

If conventional rigid micro-modules are used, then manufacturing is standardized, but a cavity must be formed in the card body increasing manufacturing cost and card thickness

Engineering Contradiction:

ImprovestandardizationVSAvoidcard structure complexity

Core Design Contradiction:

Ease of manufactureVSDevice complexity

Solution Approach 1:

The patent extracts and eliminates the cavity requirement from card manufacturing by using ultra-thin flexible FMMs that can be surface mounted or laminated between planar card layers. This removes the complex cavity-forming step while simplifying card structure.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent changes the thickness parameter of the micro-module from 0.5 mm (requiring cavity) to ultra-thin flexible dimensions enabling surface mounting. This parameter change eliminates the need for cavity formation and simplifies manufacturing.

Inventive Principle:

Principle #35Parameter changes

4Reliability

If wire bonds are used to connect IC to micro-connector, then electrical connection is established, but the assembly complexity and thickness increase

Engineering Contradiction:

Improveelectrical connectionVSAvoidassembly complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges the IC, insulating contact substrate, filled-via pad connection, and external contacts into a single integrated flexible device. This eliminates wire bonds and micro-connectors, reducing assembly complexity while maintaining electrical connection reliability through direct integration.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent introduces an insulating contact substrate with filled-via pad connection as an intermediary structure that integrates the IC bond pads with external contacts on the flexible device, eliminating the need for separate wire bonds and micro-connectors.

Inventive Principle:

Principle #24Intermediary (Mediator)

Data Source

PatentUS10438895B1Flexible micro-module

Publication Date: 2019.10.08 AMERICAN SEMICON

AI summary

The described Flexible Micro-Module (FMM) is a device that is made possible by the application of ultra-thin flexible single crystalline ICs. The FMM integrates the IC(s), insulating contact substrate, vias for connections to pads, and external contacts into a single device. The thin and flexible FMM eliminates the need for wire bonds and card body cavities in smart card assemblies, and accommodates applying larger ICs to smart cards than what is possible with conventional micro-modules.