Flexible Microelectrode Array with Zigzag Traces

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Solution Overview

Problem

Existing microelectrode arrays for implantable medical devices lack flexibility and stretchability, with materials like silicon and polyamide being non-compliant, and electroplated platinum prone to cracking, while producing high-quality thick Pt electrodes on silicone substrates is challenging, limiting their suitability for current medical applications.

Innovation Solution

A method involving micromachining techniques combines biocompatible polymeric layers with patterned metallic traces and electrodes, featuring a zigzag configuration and rounded corners, similar to metal stents, to create a flexible and stretchable microelectrode array that can be safely implanted within living tissue.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If silicon or polyamide substrates are used for microelectrode arrays, then micromachining processes can be applied, but the arrays lack flexibility and stretchability

Engineering Contradiction:
Improvemicromachining compatibilityVSAvoidflexibility and stretchability
Core Design Contradiction:
Ease of manufactureVSAdaptability or versatility

Solution Approach 1:

The patent changes the substrate material from rigid silicon or polyamide to flexible silicone rubber, fundamentally altering the mechanical properties to enable stretching and conformability while maintaining micromachining compatibility through careful process design

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent creates a composite structure combining silicone substrate with metal traces and electrodes, where each material contributes its optimal properties: silicone provides flexibility and biocompatibility, while metal provides electrical conductivity and structural integrity

Inventive Principle:
Principle #40Composite materials

2Reliability

If electroplated platinum is used for traces and electrodes, then conductive features can be formed, but cracking and delamination occur due to large residual stresses

Engineering Contradiction:
Improveconductive feature formationVSAvoidresistance to cracking and delamination
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

The patent changes the trace fabrication method from electroplating to direct deposition or lamination of flexible metallic materials, eliminating the residual stress problem inherent in electroplating while maintaining electrical conductivity

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent employs thin flexible metallic traces and electrodes that can bend and stretch with the substrate, preventing the cracking and delamination that occurs with rigid electroplated structures

Inventive Principle:
Principle #30Flexible shells and thin films

3Adaptability or versatility

If thin film gold traces are used, then flexibility is improved, but the traces are not acceptable for implantable medical devices

Engineering Contradiction:
ImproveflexibilityVSAvoidacceptability for implantable medical devices
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

The patent combines biocompatible silicone substrate with medically acceptable metal traces and electrodes, creating a composite structure that satisfies both flexibility requirements and implantable device standards

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent changes the trace material from thin film gold to flexible metallic traces with appropriate thickness and composition that meet both mechanical flexibility requirements and biocompatibility standards for implantable devices

Inventive Principle:
Principle #35Parameter changes

4Ease of manufacture

If standard deposition techniques are used on silicone substrates, then fabrication can be simplified, but producing high quality thick Pt electrodes is extremely challenging

Engineering Contradiction:
Improvefabrication simplicityVSAvoidelectrode quality
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent changes the electrode fabrication approach to accommodate the flexible silicone substrate, using deposition and lamination techniques optimized for polymer surfaces rather than traditional rigid substrate methods

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent introduces intermediate processing steps and specialized techniques as mediators between the silicone substrate and metal electrode deposition, enabling high-quality electrode formation on flexible surfaces

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentEP1790380B1Microelectrode array and method for producing the same
Publication Date: 2009.05.06 NITINOL DEVELOPMENT CORP
  • EP1790380B1 patent drawingFigure 1A~1C
  • EP1790380B1 patent drawingFigure 1D~1E
  • EP1790380B1 patent drawingFigure 2

AI summary

A high-density microelectrode array includes at least first and second implantable and biocompatible polymeric layers in which a plurality of patterned conductive features, including metallic contact pads, metallic traces and metallic electrodes are sandwiched between them. Each metallic trace is located between a metallic contact pad and a metallic electrode and has substantially rounded corners and a zigzag pattern.