Flexible Microelectronic Systems Using Composite Encapsulation

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Solution Overview

Problem

Existing wearable microelectronic systems face challenges in being skin/bio-compatible, non-permeable to environmental conditions, and able to withstand mechanical stretching/flexing, as current materials like PDMS are permeable and not suitable for long-term use.

Innovation Solution

The use of non-permeable encapsulants such as butyl rubbers, ethylene propylene rubbers, and fluoropolymer elastomers to encapsulate microelectronic systems, which provide a barrier against moisture and chemicals, and can mimic the mechanical properties of skin and clothing, allowing for cyclical stretching and flexibility.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If PDMS is used as packaging material, then flexibility and ease of manufacture are improved, but permeability to moisture and chemicals increases, reducing reliability

Engineering Contradiction:

Improveease of manufactureVSAvoidreliability

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The patent uses composite encapsulation structures combining PDMS with non-permeable barrier layers (such as parylene, aluminum, or other impermeable materials). This composite approach maintains the flexibility and ease of manufacture of PDMS while adding a protective barrier that prevents moisture and chemical permeation, thereby resolving the contradiction between ease of manufacture and reliability

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The patent implements nested encapsulation where multiple encapsulation layers are placed one inside another. The inner layer provides flexibility and comfort, while outer non-permeable layers provide environmental protection. This nested structure allows the system to benefit from both the manufacturability of PDMS and the protection of barrier materials

Inventive Principle:

Principle #7Nested doll (Nesting)

2Reliability

If non-permeable encapsulants are used, then reliability is improved, but flexibility and ability to withstand stretching may deteriorate

Engineering Contradiction:

ImprovereliabilityVSAvoidflexibility

Core Design Contradiction:

ReliabilityVSAdaptability or versatility

Solution Approach 1:

The patent applies different material properties to different parts of the encapsulation system. Flexible materials like PDMS are used in regions requiring stretch and comfort, while non-permeable barrier materials are applied in regions requiring environmental protection. This local differentiation allows the system to achieve both reliability and flexibility simultaneously

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

By creating composite encapsulation structures that combine flexible polymers with thin non-permeable barrier layers, the patent achieves a material system that exhibits both flexibility for stretching and non-permeability for reliability. The composite structure allows each material to contribute its optimal properties without compromising the other

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

These materials enhance the reliability and durability of wearable microelectronic systems by preventing damage from environmental factors and ensuring long-term functionality, while maintaining biocompatibility and flexibility.

Implementation Method 1

non-permeable encapsulants such as butyl rubbers, ethylene propylene rubbers, and fluoropolymer elastomers to encapsulate microelectronic systems, which provide a barrier against moisture and chemicals

Methodology Applied

Scientific EffectPermeation barrier: Physical Containment

Implementation Method 2

able to withstand mechanical stretching/flexing, as current materials like PDMS are permeable and not suitable for long-term use... providing for a cyclical stretching/flexing ability in the 10-30% range

Methodology Applied

Scientific EffectElasticity: Elasticity

Data Source

PatentUS10103037B2Flexible microelectronic systems and methods of fabricating the same

Publication Date: 2018.10.16 INTEL CORP

AI summary

Microelectronic systems encapsulated in a stretchable/flexible material, which is skin/bio-compatible and able to withstand environmental conditions. In one embodiment of the present description, the microelectronic system includes a microelectronic device that is substantially encapsulated in a non-permeable encapsulant, such as, butyl rubbers, ethylene propylene rubbers, fluoropolymer elastomers, or combinations thereof. In another embodiment, the microelectronic system includes a microelectronic device that is substantially encapsulated in a permeable encapsulant, such as polydimethylsiloxane, wherein a non-permeable encapsulant substantially encapsulates the permeable encapsulant.