Flexible Microelectronic Packaging for Solar Cells

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Solution Overview

Problem

Photovoltaic solar cells require performance characteristics such as low mass per area, high efficiency, portability, and ruggedness for remote power applications, which traditional rigid modules cannot provide.

Innovation Solution

A flexible packaging system for microelectronic devices, including a microelectronic device on a substrate encapsulated within an optically transparent and moisture-resistant layer, with a reinforcing layer for mechanical robustness and flexibility, allowing the device to be rolled or bent without damage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If rigid rectangular modules are used for solar power installations, then structural strength and stability are improved, but flexibility and portability deteriorate

Engineering Contradiction:

Improvestructural strengthVSAvoidflexibility

Core Design Contradiction:

StrengthVSAdaptability or versatility

Solution Approach 1:

The patent applies flexible shells and thin films by replacing rigid module structures with flexible substrates that can be rolled or bent. The encapsulation layers and protective coatings provide structural integrity while maintaining flexibility, enabling the solar device to adapt to curved surfaces and portable applications.

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The patent uses composite materials by combining flexible substrates with encapsulation layers, protective coatings, and adhesive layers to create a multi-layer structure. This composite construction provides both the flexibility needed for portability and the structural strength required for durability during handling and installation.

Inventive Principle:

Principle #40Composite materials

2Adaptability or versatility

If photovoltaic cells are made small and thin to enable flexibility, then portability and flexibility are improved, but mechanical robustness deteriorates

Engineering Contradiction:

ImproveflexibilityVSAvoidmechanical robustness

Core Design Contradiction:

Adaptability or versatilityVSStrength

Solution Approach 1:

The patent applies the nested doll principle by placing multiple protective layers around the thin photovoltaic cells. The encapsulation layers, protective coatings, and reinforcing structures are nested within and around the flexible substrate, providing mechanical robustness to the thin cells while maintaining overall flexibility of the device.

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

The patent implements beforehand cushioning by incorporating protective layers and reinforcing structures that cushion and protect the thin photovoltaic cells from mechanical damage before any harmful forces are applied. These protective elements are built into the structure in advance to prevent cracking or breakage during handling and installation.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

3Ease of operation

If the photovoltaic module is made flexible for portability, then ease of transport is improved, but resistance to rough treatment deteriorates

Engineering Contradiction:

Improveease of transportVSAvoidruggedness

Core Design Contradiction:

Ease of operationVSReliability

Solution Approach 1:

The patent uses flexible shells and thin films as protective enclosures that maintain flexibility for easy transport while providing protection against rough treatment. The encapsulation layers and protective coatings form flexible but durable barriers that shield the photovoltaic cells during handling and installation in remote locations.

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The patent employs composite materials with multiple layers including flexible substrates, encapsulation materials, protective coatings, and adhesive layers. This composite structure provides both the flexibility needed for portability and the ruggedness required to withstand rough treatment during transport and installation in remote areas.

Inventive Principle:

Principle #40Composite materials

4Reliability

If encapsulation layers are added to protect the device, then moisture resistance and protection are improved, but device flexibility deteriorates

Engineering Contradiction:

Improvemoisture resistanceVSAvoidflexibility

Core Design Contradiction:

ReliabilityVSAdaptability or versatility

Solution Approach 1:

The patent applies flexible shells and thin films by using encapsulation layers made from flexible materials that can conform to the bending of the device. These encapsulation layers provide moisture resistance and protection while maintaining the flexibility of the overall device, allowing it to be rolled or bent without compromising either protection or adaptability.

Inventive Principle:

Principle #30Flexible shells and thin films

Data Source

PatentUS9978895B2Flexible packaging for microelectronic devices

Publication Date: 2018.05.22 NATIONAL TECHNOLOGY & ENGINEERING SOLUTIONS OF SANDIA LLC

AI summary

An apparatus, method, and system, the apparatus and system including a flexible microsystems enabled microelectronic device package including a microelectronic device positioned on a substrate; an encapsulation layer encapsulating the microelectronic device and the substrate; a protective layer positioned around the encapsulating layer; and a reinforcing layer coupled to the protective layer, wherein the substrate, encapsulation layer, protective layer and reinforcing layer form a flexible and optically transparent package around the microelectronic device. The method including encapsulating a microelectronic device positioned on a substrate within an encapsulation layer; sealing the encapsulated microelectronic device within a protective layer; and coupling the protective layer to a reinforcing layer, wherein the substrate, encapsulation layer, protective layer and reinforcing layer form a flexible and optically transparent package around the microelectronic device.