Flexible Micro-LED Panel Structure for Bend-Safe Wiring
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Flexible micro-LED display panels face challenges with low yield due to issues such as wire disconnection and difficulty in bending, leading to high production costs.
Innovation Solution
A flexible micro-LED display panel design featuring a first and second base substrate made of CPI, a thin film transistor array layer, connecting electrode layers, micro-LED chips with pins for die bonding, and a flexible encapsulation layer, with a neutral layer positioned at the thin film transistor array layer to reduce wire disconnection risk.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If flexible micro-LED display panels are designed with conventional structures, then flexibility is improved, but wire disconnection occurs and yield decreases
Solution Approach 1:
The patent introduces a dual-base-substrate structure (first base substrate for TFT array, second base substrate for micro-LED chips) with a neutral layer positioned between them. This dimensional restructuring allows the neutral layer to remain stationary during bending, preventing wire disconnection while maintaining overall panel flexibility. The neutral layer acts as a stable reference plane that decouples the bending stress from the electrical connections.
Solution Approach 2:
The patent changes the structural parameters by positioning the neutral layer at a specific location within the multi-layer structure (between the two base substrates). This parameter adjustment ensures that the neutral layer experiences minimal stress during flexing, thereby preventing wire disconnection while preserving the flexibility of the display panel.
2Adaptability or versatility
If micro-LED chips are transferred to flexible substrates, then flexibility is achieved, but transfer difficulty increases and yield decreases
Solution Approach 1:
The patent divides the display panel into two separate base substrates: the first base substrate carries the TFT array layer, and the second base substrate carries the micro-LED chips. This segmentation allows independent optimization of each substrate and simplifies the chip transfer process, as micro-LED chips can be transferred to the second base substrate without handling the entire flexible structure, thereby improving manufacturing ease and yield.
3Reliability
If neutral layer is positioned at thin film transistor array layer, then wire disconnection is reduced, but structural complexity increases
Solution Approach 1:
The neutral layer in the patent serves multiple functions simultaneously: it acts as a mechanical neutral plane during bending, provides a stable mounting surface for micro-LED chips, and serves as a structural backbone for the entire display panel. This multi-functionality reduces the need for additional components, thereby limiting the increase in structural complexity while achieving wire disconnection prevention.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances flexibility, reduces wire disconnection, and improves yield, enabling high transparency, fast response times, long service life, and drop resistance, allowing for dynamic bending and broadening display applications.
Implementation Method 1
micro-light emitting diode (micro-LED) display panels
Data Source
AI summary
The present application provides a flexible micro-LED display panel and a manufacturing method thereof. The flexible micro-LED display panel includes a first base substrate, a thin film transistor array layer, a first connecting electrode layer, a second connecting electrode layer, a plurality of micro-LED chips, a flexible encapsulation layer, and a second base substrate, wherein the first base substrate and the second base substrate are flexible substrates, the second base substrate is provided on the flexible encapsulation layer covering the micro-LED chips to make a neutral layer of the panel to be located at the thin film transistor array layer, reducing a risk of wiring disconnection.