Flexible Micro-LED Packaging Structure for Ultra-Thin Circuit Routing

The patent replaces the rigid printed circuit board with a flexible substrate that has sufficient mechanical strength despite its thin profile. The flexible substrate supports the light emitting chip and conductive structures while enabling the overall packaging thickness to be reduced below conventional limits, directly resolving the contradiction between structural strength and packaging thickness.

The patent redistributes circuit elements and conductive structures in three-dimensional space using multiple layers and vertical arrangements. By moving conductive paths to different levels and using vias for inter-layer connections, the design achieves sufficient electrical connectivity and mechanical support without increasing the horizontal footprint or requiring a thick rigid substrate.

The patent transitions from planar two-dimensional circuit traces to a three-dimensional multi-layer circuit architecture. Conductive paths are distributed across multiple layers with vertical interconnections via vias, allowing sufficient current carrying capacity and electrical reliability to be achieved with much thinner individual trace sections and reduced overall device volume compared to conventional single-layer thick traces.

The circuit structure is divided into multiple segments across different layers. Instead of using single thick continuous traces, the electrical pathways are segmented into thinner traces distributed across multiple levels, connected by vias. This segmentation maintains electrical reliability through redundant paths and adequate current distribution while significantly reducing the volume required for each conductive element.