Flexible Midplane Architecture for Multi-Processor Airflow
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Solution Overview
Problem
Traditional backplanes in multi-processor computer systems hinder effective airflow due to their rigid, two-dimensional design, limiting cooling efficiency and circuit routing options, and making it difficult to achieve front-to-back or back-to-front airflow.
Innovation Solution
The implementation of flexible midplanes with bent side sections and a middle section, allowing for orthogonal bending, which enables effective front-to-back and back-to-front airflow while maintaining access to circuit boards without disassembly, using materials like FR4 and Kapton for flexibility and structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a rigid, two-dimensional backplane is used, then structural stability is improved, but airflow efficiency deteriorates
Solution Approach 1:
The backplane is transformed from a rigid, static structure to a flexible, dynamic one capable of bending in multiple directions. The flexible backplane can be configured in different shapes (e.g., U-shape, zigzag) to optimize airflow paths while maintaining structural integrity through its flexible nature.
Solution Approach 2:
The invention directly applies this principle by replacing the rigid backplane with a flexible backplane made of flexible circuit board material. This flexible backplane can bend and flex to create optimal airflow channels, allowing cooling air to flow horizontally across the cabinet while maintaining the necessary structural support for circuit boards and connectors.
2Manufacturing precision
If a rigid backplane is used, then manufacturing precision is improved, but adaptability deteriorates
Solution Approach 1:
The flexible backplane can be manufactured with standard precision but then configured into different shapes and arrangements to adapt to various system requirements. The same flexible backplane can be bent into different configurations (U-shape, zigzag, etc.) to accommodate different airflow needs, component layouts, and cabinet sizes, providing high adaptability without compromising manufacturing precision.
Solution Approach 2:
The invention changes the key parameter of backplane rigidity to flexibility, which enables the backplane to be manufactured with standard precision but then adapted to different configurations through bending and flexing. This parameter change allows the same component to serve multiple functions and adapt to various system designs.
3Ease of manufacture
If a rigid backplane is used, then ease of manufacture is improved, but airflow impedance increases
Solution Approach 1:
The flexible backplane is manufactured using standard flexible circuit board techniques, which are well-established and economically viable. The flexibility of the material allows it to be formed into shapes that create open airflow channels, significantly reducing airflow impedance while maintaining ease of manufacture through conventional fabrication processes.
Solution Approach 2:
The flexible backplane can be bent into curved shapes (U-shapes, zigzags) that optimize airflow paths. These curved configurations create channels that guide cooling air efficiently across the cabinet, reducing turbulence and impedance while still being manufacturable using standard flexible circuit board bending and forming techniques.
4Area of stationary object
If a two-dimensional backplane is used, then circuit routing area is limited, but structural simplicity is maintained
Solution Approach 1:
The backplane transitions from a two-dimensional flat structure to a three-dimensional flexible structure that can be bent into various shapes. This adds a spatial dimension to the circuit routing area, allowing circuits to be routed on multiple surfaces and along bent paths, significantly increasing the available routing area without proportionally increasing structural complexity.
Solution Approach 2:
The flexible backplane's ability to bend and flex creates additional spatial dimensions for circuit routing. The same backplane can be configured in different three-dimensional shapes to optimize routing paths for different system configurations, increasing routing area while maintaining relatively simple flexible circuit board construction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances airflow efficiency, reduces impedance, and increases the available circuit routing area, allowing for better heat management and system design flexibility in multi-processor systems.
Implementation Method 1
a flexible region disposed between the middle section and each side section; wherein each flexible region permits the corresponding side section to be bent in relation to the middle section
Data Source
AI summary
A flexible midplane comprises: a printed circuit board including: a middle section and at least one side section; and a flexible region disposed between the middle section and each side section; wherein each flexible region permits the corresponding side section to be bent in relation to the middle section.