Flexible Millimeter Wave Substrate with Distributed Stacked Antenna
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Solution Overview
Problem
Current microelectronic devices face signal attenuation losses due to the integration of radio frequency chips and antennas within the same substrate, which is inadequate for high-frequency communication systems like 5G and WiGig that require phased array antennas to compensate for path losses and low transistor output power.
Innovation Solution
The design employs a flexible millimeter wave package substrate with a distributed stacked antenna configuration, where the antenna is split between the substrate and the device housing, using different coupling mechanisms and integrating various antenna types, such as monopole, dipole, and Vivaldi radiators, to reduce signal attenuation and maintain high gain.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If radio frequency chips and antennas are integrated on the same substrate, then device complexity is reduced and miniaturization is achieved, but signal attenuation losses increase due to losses inside the device housing
Solution Approach 1:
The antenna is segmented into two parts: a first portion on the flexible package substrate and a second portion on the device housing. This segmentation allows the antenna to extend outside the housing, reducing signal attenuation losses while maintaining the benefits of integration.
Solution Approach 2:
The antenna structure transitions from a two-dimensional planar integration on the substrate to a three-dimensional distributed configuration that extends from the substrate through the housing to the external environment, reducing signal losses by utilizing the third dimension.
2Reliability
If stacked patch antenna is used to increase bandwidth and maintain high gain, then communication performance is improved, but the antenna structure becomes more complex and occupies more space
Solution Approach 1:
The stacked patch antenna is divided into multiple portions distributed across different substrates and locations (package substrate and device housing), reducing the complexity and space occupation at any single location while maintaining the overall high gain performance.
Solution Approach 2:
The distributed antenna portions work together to provide multiple functions: the first portion on the substrate provides feeding and initial radiation, while the second portion on the housing extends the radiation pattern and reduces losses, creating a multi-functional antenna system.
3Reliability
If phased array antennas are implemented to compensate for path losses, then communication reliability is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The phased array antenna is segmented into distributed portions that can be manufactured separately on different substrates (package substrate and device housing) and then assembled, simplifying the manufacturing process while maintaining the path loss compensation capability.
Solution Approach 2:
The flexible package substrate enables dynamic reconfiguration of the antenna phases and orientations, allowing the phased array to adapt to different communication requirements while maintaining a relatively simple fixed manufacturing structure.
4Manufacturing precision
If traditional rigid substrate is used for antenna integration, then manufacturing precision is maintained, but flexibility and thin form factor are compromised
Solution Approach 1:
The package substrate is made flexible, allowing it to be bent and oriented in different directions to achieve various antenna orientations and patterns. This flexibility enables thin form factors and adaptive positioning while maintaining manufacturing precision through controlled flexibility parameters.
Solution Approach 2:
The flexible substrate introduces dynamic adaptability to the antenna system, allowing the antenna orientation and configuration to be adjusted after manufacturing by bending or positioning the flexible substrate in different orientations, thereby achieving versatility without compromising manufacturing precision.
Data Source
AI summary
Embodiments of the invention include a microelectronic device that includes a first substrate having organic dielectric material, conductive layers, and a first portion of a distributed antenna unit. The first substrate supports at least one radio frequency (RF) component. A second substrate is coupled to the first substrate. The second substrate is integrated with a housing of the microelectronic device and includes a second portion of the distributed antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher.