Flexible Wiring Module Potting Frame for Stress and Moisture Protection

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Solution Overview

Problem

Existing conductive modules with flexible printed wiring boards lack effective protection for electronic components against external stress and interference, as well as adequate moisture and insulation resistance.

Innovation Solution

A conductive module comprising a flexible printed wiring board, an electronic component connected to its circuit pattern, a metal plate with a frame surrounding the component, and a potting agent filled within the frame to cover the component, providing reinforcement and protection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If electronic components are mounted on flexible printed wiring boards, then circuit functionality is achieved, but the components are vulnerable to external stress and environmental damage

Engineering Contradiction:

Improvecomponent protectionVSAvoidexternal stress and moisture

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent applies beforehand cushioning by filling a potting agent into the flexible printed wiring board before the component is mounted, creating a protective cushioning layer in advance that will later protect the component from external stress and environmental damage

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Solution Approach 2:

The patent implements nesting by placing the electronic component inside the flexible printed wiring board structure, with the component nested within the board's internal cavity and surrounded by the potting agent for protection

Inventive Principle:

Principle #7Nested doll (Nesting)

2Reliability

If electronic components are mounted on flexible printed wiring boards, then circuit functionality is achieved, but moisture and insulation resistance are insufficient

Engineering Contradiction:

Improveinsulation resistanceVSAvoidmoisture

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Solution Approach 2:

The potting agent creates an inert protective environment around the electronic component, isolating it from moisture and corrosive atmospheric elements, thereby improving insulation resistance and long-term reliability

Inventive Principle:

Principle #39Inert atmosphere (Inert environment)

Data Source

PatentUS20230389187A1Conductive module

Publication Date: 2023.11.30 YAZAKI CORP

AI summary

A conductive module includes: a flexible printed wiring board; an electronic component that is mounted on the flexible printed wiring board and connected to a circuit pattern of the flexible printed wiring board; a metal plate that includes a frame part surrounding the electronic component and being fixed to the flexible printed wiring board; and a potting agent that is filled in a region surrounded by the frame part to cover the electronic component.