Flexible Motor Coil Substrate for High Space Factor and Precision
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Solution Overview
Problem
Existing motor coil substrates face challenges in increasing the space factor and positional accuracy of coils, particularly when formed from wires, which can lead to inefficiencies and potential breakage during winding.
Innovation Solution
A motor coil substrate with a flexible substrate featuring multiple spiral coils that are formed using printed wiring board technology, where the substrate is folded at specific lines to allow partial overlap of adjacent coils, increasing the space factor and enabling high-accuracy stacking, and then wound around a magnet to enhance efficiency and torque.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If coils are formed from wires, then flexibility is improved, but manufacturing precision and positional accuracy deteriorate
Solution Approach 1:
The patent changes the physical state of the conductor from flexible wire to rigid printed circuit board trace. This parameter change allows the conductor to maintain precise positional accuracy during manufacturing while still achieving the required flexibility through the flexible substrate base layer and folding configuration
Solution Approach 2:
The patent replaces the mechanical wire winding system with a printed circuit board fabrication system. The coils are formed using standard PCB processes (copper deposition, etching, plating) on a flexible substrate, eliminating the need for manual or automated wire winding while achieving superior positional accuracy
2Ease of manufacture
If coils are formed from wires, then ease of manufacture is improved, but space factor and manufacturing precision deteriorate
Solution Approach 1:
The patent replaces wire winding operations with printed circuit board fabrication processes. The coils are created through copper deposition and etching on a flexible substrate, which is a standard, highly precise manufacturing process that simultaneously improves ease of manufacture and achieves high space factor through precise coil geometry control
Solution Approach 2:
The patent changes the conductor form from wire to printed circuit trace, enabling the use of automated PCB manufacturing processes. This allows for precise control of coil dimensions, winding patterns, and spacing, achieving high space factor while maintaining ease of manufacture through standardized fabrication processes
3Device complexity
If coils are formed from wires, then device complexity is reduced, but manufacturing precision and reliability deteriorate
Solution Approach 1:
The patent merges the conductor, insulation, and substrate into a single integrated flexible printed circuit board structure. The coil traces are formed directly on the flexible substrate with built-in insulation layers, eliminating separate wire, insulation material, and mounting structure components. This integration maintains low device complexity while achieving high positional accuracy through precision PCB fabrication
Solution Approach 2:
The patent replaces the mechanical assembly of wired coils with an integrated printed circuit board structure. The coils are formed as traces on the flexible substrate through PCB processes, eliminating the need for separate wire winding, insulation wrapping, and mechanical assembly steps, thereby maintaining simplicity while achieving superior manufacturing precision
4Ease of manufacture
If coils are formed from wires, then ease of manufacture is improved, but conductor resistance increases
Solution Approach 1:
The patent changes the conductor cross-section from circular wire to rectangular PCB trace, allowing for increased copper thickness and width. The multi-layer PCB structure enables thicker copper deposits and wider trace paths, significantly reducing conductor resistance while maintaining ease of manufacture through standard PCB fabrication processes
Solution Approach 2:
The patent merges multiple copper layers within the PCB structure to create low-resistance coil paths. The integrated construction allows for optimized current distribution across multiple conductive layers, reducing overall conductor resistance while maintaining manufacturing simplicity through a single fabrication process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution increases the space factor of the coils, reduces conductor resistance, and enhances the efficiency and torque of the motor by allowing precise stacking and overlapping of coils, resulting in a high-efficiency motor design.
Implementation Method 1
The flexible substrate has multiple folding lines formed and the multiple coils positioned such that the flexible substrate is folded at the folding lines and wound around a magnet
Implementation Method 2
multiple coils formed on the flexible substrate such that each of the coils has a spiral shape... wound around a magnet... enhances the efficiency and torque of the motor
Data Source
AI summary
A motor coil substrate includes a flexible substrate, and multiple coils formed on the flexible substrate such that each of the coils has a spiral shape. The flexible substrate has multiple folding lines formed and the multiple coils positioned such that the flexible substrate is folded at the folding lines and wound around a magnet and that an m-th coil and an (m+1)-th coil of the coils partially overlap one another when folded at the folding lines.