Flexible Multilayer Electronic Structures With Graphene Ink Drying
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for manufacturing flexible multilayer electronic structures are inefficient and difficult to implement due to the need for complex layer bonding and electrical connections, particularly with conductive inks that require drying before adding insulation layers.
Innovation Solution
A method involving the deposition of graphene ink on a polymer passivation layer, followed by bonding a pre-treated carrier layer, cutting out graphene zones, applying adhesive strips, and integrating electronic components and interconnects, with infrared drying to expedite the process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conductive ink is used to deposit electronic components, then the components can be integrated onto the flexible film, but the ink must be dried before adding another layer of insulation, increasing manufacturing time and complexity
Solution Approach 1:
The patent applies preliminary action by depositing the complete insulating layer over the conductive ink pattern before the ink is fully dried. This allows the insulating layer to be applied while the conductive ink is still in a semi-liquid state, eliminating the need to wait for complete drying and enabling continuous manufacturing without time loss.
Solution Approach 2:
The patent merges the deposition of the insulating layer with the drying process of the conductive ink. By applying the insulating layer during the drying phase rather than after complete drying, the manufacturing process combines two operations into one continuous flow, reducing overall manufacturing time and simplifying the process sequence.
2Adaptability or versatility
If multiple layers are deposited and bonded to create flexible electronic structures, then the functional requirements can be met, but the manufacturing method becomes difficult and complex
Solution Approach 1:
The patent segments the manufacturing process into distinct functional steps: depositing conductive ink patterns, applying insulating layers, cutting out zones, and bonding carrier layers. This segmentation allows each step to be optimized independently and simplifies the overall process by breaking down the complex multilayer construction into manageable operations.
Solution Approach 2:
The patent introduces a carrier layer as an intermediary element that facilitates the bonding process. The carrier layer with pressure-sensitive adhesive acts as a mediator between the passivation layer and the substrate, simplifying the bonding operation and reducing the complexity of directly bonding multiple functional layers together.
3Reliability
If graphene ink is deposited on polymer passivation layer and carrier layer is bonded, then the structure achieves mechanical resistance and air-tightness, but the process requires precise cutting and adhesive application
Solution Approach 1:
The patent applies local quality by cutting out specific zones from the continuous graphene layer and passivation layer combination. This allows different regions of the structure to have different properties: the cut-out zones provide access for electronic components while the remaining continuous regions maintain mechanical strength and air-tightness, optimizing both functionality and manufacturing precision.
Solution Approach 2:
The carrier layer with pressure-sensitive adhesive serves as an intermediary that simplifies the bonding process. Instead of directly bonding the passivation layer to the substrate with precise alignment, the carrier layer acts as a mediator that provides built-in alignment and bonding, reducing the precision requirements for the final assembly step.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates the efficient and rapid production of flexible, air-tight, and mechanically resistant multilayer electronic structures with integrated components, reducing manufacturing complexity and time.
Implementation Method 1
bonding a polymer so-called carrier layer pre-treated with a pressure-sensitive adhesive to the polymer passivation layer
Implementation Method 2
with infrared drying to expedite the process
Data Source
AI summary
A method for manufacturing a multilayer structure comprises depositing a coat of graphene ink on a passivation layer; bonding a polymer so-called carrier layer using an adhesive; drying the coat of ink; removing some of the graphene and the passivation layer from a first face without cutting into the polymer carrier layer and while removing the polymer carrier layer and the cut-out zones from the second face; bonding adhesive strips along the longitudinal periphery on each side of the passivation layer and in part of the zones with the cut-out graphene; placing electronic components, electrodes, on a polymer substrate layer; and bonding the passivation layer to the substrate layer with the electronic components in that part of the passivation zones that has the graphene cut out.