Flexible Multilayer Implantable Antenna Assembly
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Solution Overview
Problem
The high cost and variability in electrical and mechanical properties of implantable antenna assemblies for cochlear implants due to manual manufacturing processes, leading to inconsistent transmission characteristics and dimensional variations.
Innovation Solution
The development of a flexible implantable antenna assembly using a multilayer substrate with conductive metal traces on polyimide or liquid crystal polymer, formed through printing and lamination techniques, which reduces production costs and deviations, while enhancing flexibility and impact resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If manual manufacturing processes are used for implantable antenna assemblies, then flexibility in assembly can be achieved, but production cost increases and manufacturing precision deteriorates
Solution Approach 1:
The patent changes the manufacturing approach from manual assembly to automated lamination processes, transforming the production parameters to achieve both consistency and efficiency. The lamination process uses controlled temperature, pressure, and time parameters to ensure uniform bonding and precise dimensional control across all antenna assemblies.
Solution Approach 2:
The patent replaces manual mechanical assembly operations with automated lamination technology. The lamination process uses controlled thermal and pressure fields instead of manual manipulation, eliminating human variability and achieving consistent manufacturing precision while reducing labor costs.
2Ease of manufacture
If manual manufacturing processes are used for implantable antenna assemblies, then custom assembly can be performed, but productivity decreases and production cost increases
Solution Approach 1:
The patent replaces manual assembly operations with automated lamination processes that can handle high-volume production. The lamination system uses programmable control to accommodate different antenna designs and configurations, maintaining custom assembly capability while dramatically increasing production throughput and reducing per-unit costs.
Solution Approach 2:
The lamination process is designed to be universal, capable of manufacturing various antenna assembly types and configurations through programmable parameters. This multi-functionality allows the same equipment to produce different antenna designs, maintaining customization flexibility while achieving high-volume automated production.
3Strength
If thicker substrate materials are used for antenna assemblies, then structural strength improves, but flexibility deteriorates and implantation trauma increases
Solution Approach 1:
The patent employs composite material construction with multiple thin substrate layers laminated together. This approach provides the necessary structural strength through the combined layers while maintaining the flexibility of individual thin layers. The lamination interface between layers allows for controlled flexibility and conformability to the implantation site.
Solution Approach 2:
The patent transitions from using a single thick substrate to multiple thin substrates arranged in layers. This dimensional change from one-thick-to-many-thin provides both strength (through the stacked structure) and flexibility (through the thin individual layers and inter-layer compliance), resolving the contradiction between strength and flexibility.
4Reliability
If multiple discrete dielectric layers are used in antenna assemblies, then electrical performance can be optimized, but device complexity increases
Solution Approach 1:
The patent merges multiple discrete dielectric layers into an integrated laminated structure. The lamination process combines the dielectric layers with antenna conductors and other components into a unified assembly, maintaining the electrical performance benefits of multiple layers while reducing the overall device complexity through integrated construction.
Solution Approach 2:
The laminated structure serves multiple functions simultaneously: it provides dielectric isolation, mechanical support, electrical connection pathways, and structural integrity. This multi-functionality reduces the need for separate components, thereby reducing device complexity while maintaining optimized electrical performance through the integrated multi-layer design.
Data Source
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AI summary
An implantable antenna assembly includes a multilayer flexible printed circuit board comprising a first flexible substrate, second flexible substrate, and third flexible substrate. An inductor coil is formed by electrically conductive traces disposed on the first flexible substrate. A shield is formed by electrically conductive traces disposed on the second flexible substrate and third flexible substrate, the shield surrounding the inductor coil. A method for forming an implantable antenna assembly is also provided.