Flexible Nanostructured Mask for Large-Area Nanopatterning
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Solution Overview
Problem
Current nanopatterning methods, such as nanoimprint lithography and soft lithography, face challenges with throughput, reliability, and uniformity, particularly when patterning large substrates, due to issues like template lifetime, imprint layer tolerances, and defects caused by thermal expansion and material shrinkage.
Innovation Solution
The use of near-field UV photolithography with a flexible, nanostructured mask that employs either phase-shifting or surface plasmon technology, where the mask is in contact with the substrate, utilizing Van-der-Vaals forces for uniform contact and potentially a transparent cylinder for controlled pressure, to achieve consistent and efficient patterning across large areas.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If nanoimprint lithography is used to pattern large substrates, then throughput can be improved, but manufacturing precision deteriorates due to template lifetime issues, imprint layer tolerance variations, and defects from thermal expansion and material shrinkage
Solution Approach 1:
The patent replaces the mechanical contact-based nanoimprint lithography system with an optical near-field photolithography system. Instead of using physical molds that require mechanical pressure and thermal processing, the invention uses optical fields to pattern the substrate. This substitution eliminates the mechanical wear, thermal expansion issues, and material shrinkage problems inherent in nanoimprint lithography, thereby maintaining high throughput while improving pattern uniformity and manufacturing precision.
Solution Approach 2:
The patent introduces a flexible film as an intermediary carrier that holds the mask pattern. This flexible film serves as a mediator between the mask and the substrate, allowing for uniform contact across large substrate areas through Van der Waals forces. The flexible film can conform to the substrate surface, ensuring consistent patterning across large areas without the defects associated with rigid molds, thus resolving the contradiction between throughput and precision.
2Manufacturing precision
If a rigid mask is used for near-field photolithography, then manufacturing precision can be maintained, but adaptability deteriorates when handling flexible and curved substrates
Solution Approach 1:
The patent employs a flexible film instead of a rigid mask or substrate holder. This flexible film can conform to both flat and curved substrate surfaces, maintaining uniform contact across the entire patterning area. The flexibility of the film allows the system to adapt to various substrate geometries while the optical near-field technique ensures high feature replication accuracy. This resolves the contradiction by providing both adaptability to flexible substrates and precision in pattern transfer.
3Productivity
If thermal processing is applied in nanoimprint lithography to achieve pattern transfer, then productivity can be improved through continuous processing, but reliability deteriorates due to thermal expansion causing defects
Solution Approach 1:
The patent replaces thermal-mechanical processing with optical processing. Instead of heating the substrate and mold to achieve pattern transfer, the invention uses optical near-field photolithography where UV light exposes the photoresist through the flexible film mask. This eliminates thermal expansion and the associated defects entirely, while the continuous UV exposure process maintains high productivity. The optical process is inherently more reliable as it avoids thermal-related failure modes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables high-throughput, reliable, and uniform nanopatterning of large substrates with improved feature replication accuracy, reducing defects and extending mask lifetime, while allowing for flexible and curved substrate handling.
Implementation Method 1
employing either phase-shifting or surface plasmon technology, where the mask is in contact with the substrate, utilizing Van-der-Vaals forces for uniform contact
Implementation Method 2
The use of near-field UV photolithography with a flexible, nanostructured mask
Implementation Method 3
employing either phase-shifting or surface plasmon technology
Implementation Method 4
employing either phase-shifting or surface plasmon technology
Data Source
AI summary
Embodiments of the invention relate to methods and apparatus useful in the nanopatterning of large area substrates, where a movable nanostructured film is used to image a radiation-sensitive material. The nanopatterning technique makes use of Near-Field photolithography, where the nanostructured film used to modulate light intensity reaching radiation-sensitive layer. The Near-Field photolithography may make use of an elastomeric phase-shifting mask, or may employ surface plasmon technology, where a movable film comprises metal nano holes or nanoparticles.