Flexible NTC Thin-Film Thermistor for Fast Temperature Sensing
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Solution Overview
Problem
Existing NTC thermistors are too large for many applications, limiting their integration in electronic devices and hindering the development of more intelligent and secure end devices, as they occupy valuable space and do not offer the necessary flexibility and sensitivity.
Innovation Solution
The development of an NTC thin-film thermistor with extremely thin, flexible design featuring a functional ceramic with a spinel or perovskite structure and conductive ceramic electrodes, allowing for precise temperature measurement and reduced thermal mass, enabling improved response time and sensitivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If conventional NTC thermistor construction is used, then temperature measurement function is achieved, but the device size is too large for miniaturized electronic applications
Solution Approach 1:
The patent transitions from bulk three-dimensional thermistor construction to thin-film layered structure, reducing the thermistor thickness to the micrometer range while maintaining functional performance. This dimensional change enables miniaturization suitable for modern electronic devices while preserving temperature measurement capability through controlled film thickness and composition.
Solution Approach 2:
The patent employs thin-film technology to create flexible, bendable thermistor structures with thickness less than 10 μm. The thin-film construction on flexible substrates allows the device to be bent without mechanical damage, enabling new applications in flexible electronics and wearable devices while maintaining measurement precision.
2Speed
If conventional thermistor thickness is used, then structural stability is maintained, but thermal mass is high resulting in slow response time
Solution Approach 1:
The patent changes the thickness parameter from conventional dimensions to the micrometer range, reducing thermal mass and improving response time. The thin-film structure with controlled thickness enables faster thermal response while mechanical stability is maintained through appropriate substrate selection and film composition design.
3Adaptability or versatility
If thin-film construction is used, then device flexibility and reduced thermal mass are achieved, but manufacturing precision requirements increase
Solution Approach 1:
The patent utilizes thin-film deposition techniques to create flexible thermistor structures with controlled thickness in the micrometer range. The thin-film construction provides mechanical flexibility and bendability while standard deposition processes maintain sufficient thickness control for functional performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The thin-film design allows for precise temperature measurement, increased mechanical stability, and reduced electrical resistance, making it suitable for high-temperature applications and enabling new application possibilities by saving space in electronic devices.
Implementation Method 1
NTC thermistors are resistors with negative temperature coefficients that are frequently used as sensors for temperature measurement in electronic devices
Implementation Method 2
The NTC thin film comprises a single- or polycrystalline functional ceramic with a spinel or perovskite structure. Functional ceramics with a perovskite structure are particularly suitable for use at high temperatures, as the electrical properties of perovskite structures are less affected at high temperatures
Data Source
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AI summary
The invention relates to an NTC thin film thermistor (1) which consists of at least a first thin film electrode (3a), at least an NTC thin film (2) and at least a second thin film electrode (3b). A further aspect of the invention relates to a method for producing an NTC thin film thermistor (1).