Flexible OLED Edge Structure for Inorganic Film Crack Suppression
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Solution Overview
Problem
In the manufacturing process of flexible organic EL display devices, cracks can occur in inorganic insulating films at the end edges of cut-out display devices, leading to moisture and oxygen ingress, which can result in poor display performance.
Innovation Solution
The display device includes a resin substrate with a first opening in the inorganic insulating film exposing the upper face of the resin substrate, covered by a first filling layer, and lead wiring lines extending to the end edge in contact with the inorganic insulating film and filling layer, preventing cracks and reinforcing the edge.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the mother substrate is divided by laser light to cut out organic EL display devices, then the display devices can be individually separated, but cracks occur in the inorganic insulating film at the end edge leading to moisture and oxygen ingress
Solution Approach 1:
The inorganic insulating film is segmented by forming a first opening that divides it into a first inorganic insulating film layer and a second inorganic insulating film layer. This segmentation prevents crack propagation through the entire film by creating a discontinuity at the end edge, while still allowing the laser cutting process to separate individual display devices from the mother substrate.
Solution Approach 2:
A first filling layer is introduced as an intermediary material to fill the first opening in the inorganic insulating film. This filling layer acts as a mediator that prevents moisture and oxygen from entering through the opening while maintaining the structural integrity and electrical functionality of the end edge region.
2Area of stationary object
If the frame region is reduced by bending the frame region positioned on the terminal side, then the frame region size is reduced, but the wiring line arranged in the frame region may be broken
Solution Approach 1:
The inorganic insulating film is segmented into multiple layers by the first opening, which prevents crack propagation. This segmentation creates a more flexible structure at the end edge that can accommodate bending without breaking the wiring lines, allowing the frame region to be reduced while maintaining wiring integrity.
Solution Approach 2:
The first filling layer is provided beforehand to fill the first opening and prevent crack propagation. This prior cushioning protects the wiring lines and inorganic insulating film from damage during bending operations, enabling the frame region to be reduced without compromising wiring line integrity.
3Reliability
If the first opening is formed in the inorganic insulating film to prevent cracks, then crack propagation is suppressed, but the structure becomes more complex
Solution Approach 1:
The inorganic insulating film is segmented into multiple layers through the first opening, which suppresses crack propagation. While this increases structural complexity, the segmentation is achieved through standard photolithography and etching processes, making the complexity manageable and manufacturable.
Solution Approach 2:
The first filling layer is introduced as an intermediary to fill the first opening. This filling layer simplifies the overall structure by providing a straightforward material solution that prevents crack propagation without requiring complex multi-layer insulating structures or additional protective mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration suppresses the occurrence and progression of cracks in the inorganic insulating film at the end edge, preventing moisture and oxygen ingress and maintaining display quality.
Implementation Method 1
a first opening penetrating the inorganic insulating film and causing at least a part of an upper face of the resin substrate to be exposed
Implementation Method 2
a first filling layer provided to cover an edge portion of the first opening in an interior of the first opening
Implementation Method 3
the plurality of lead wiring lines is provided up to the end edge on the terminal side in contact with upper faces of the at least one layer of the inorganic insulating film and the first filling layer
Data Source
AI summary
Between an end edge on a terminal side of a resin substrate layer in a frame region and a display region, an inorganic layered film is provided with a first opening penetrating the inorganic layered film and causing at least a part of an upper face of the resin substrate layer to be exposed, a first filling layer is provided in an interior of the first opening to cover an edge portion thereof, a plurality of lead wiring lines are provided to the end edge on the terminal side in contact with upper faces of the inorganic layered film and the first filling layer, extend in parallel to each other in a direction intersecting the end edge on the terminal side in the frame region, and are electrically connected to a plurality of terminals respectively.