Multi-Layered Gate Metal for Flexible OLED Bending

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Solution Overview

Problem

Existing flexible array substrates for OLED displays have low bending tolerance due to thick molybdenum gate layers, which complicates the hydrogenated activating process and limits manufacturing efficiency.

Innovation Solution

Replacing the single molybdenum gate layers with multi-layered composite metal layers, comprising titanium, molybdenum, and aluminum, to enhance bending tolerance and reduce thickness while maintaining impedance, and separating the activation and hydrogenation processes to simplify the manufacturing method.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If a single-layer molybdenum gate layer is used, then the manufacturing process is simple, but the bending tolerance is low and the thickness is large

Engineering Contradiction:
Improvegate layer structureVSAvoidbending tolerance
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The single-layer molybdenum gate layer is segmented into a multi-layer composite structure consisting of Ti/Mo/Ti layers. This segmentation allows each sub-layer to contribute different properties: Ti provides flexibility and bending tolerance, while Mo provides low resistance. The total thickness is reduced to 100-150nm while maintaining electrical performance and improving bendability.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The gate layer uses a composite material structure combining titanium (Ti) and molybdenum (Mo) in a Ti-Mo-Ti configuration. Ti has superior flexibility and bending properties, while Mo has low electrical resistance. The composite structure achieves both high bending tolerance and low resistance, resolving the contradiction between structural simplicity and reliability.

Inventive Principle:
Principle #40Composite materials

2Reliability

If continuous hydrogenated activating process is used for thick gate layers, then the activation is effective, but the process complexity and thermal stress increase

Engineering Contradiction:
Improveactivation effectivenessVSAvoidmanufacturing process
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The gate layer structure is pre-designed with thin total thickness (100-150nm) and optimized material composition before the hydrogenated activating process. This preliminary structural optimization enables effective activation with shorter processing time and lower thermal stress, eliminating the need for continuous prolonged heating that would be required for thicker gate layers.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

By changing the gate layer thickness parameter from traditional thick (250nm+) to thin (100-150nm) and changing the material composition to Ti-Mo-Ti composite, the hydrogenated activating process parameters can be optimized: shorter time, lower temperature, and reduced thermal stress. This resolves the contradiction between activation effectiveness and process complexity.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The multi-layered composite metal layers improve the bending tolerance and resolution of the display panel, allowing for thinner films and higher yield with reduced thermal stress, and simplify the doping and activation processes, ensuring effective hydrogenation without continuous high-temperature exposure.

Implementation Method 1

The multi-layered composite metal layer includes a first metal layer, a second metal layer, and a third metal layer disposed between the first metal layer and the second metal layer. Where the first metal layer and the second metal layer are composed of titanium or molybdenum, and the third metal layer is composed of aluminum.

Methodology Applied
Scientific EffectThermal expansion: Thermal Expansion

Implementation Method 2

depositing the first gate insulating layer and sputtering deposition the first gate layer on the first gate insulating layer

Methodology Applied
Scientific EffectSputtering deposition: Sputtering

Data Source

PatentUS10950677B2Array substrate, manufacturing method thereof, and display panel
Publication Date: 2021.03.16 WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO LTD
  • US10950677B2 patent drawing
  • US10950677B2 patent drawing
  • US10950677B2 patent drawing

AI summary

The present disclosure provides an array substrate and a manufacturing method of the array substrate, and a display panel. The array substrate includes a flexible substrate; an active layer disposed on the flexible substrate; a first gate insulating layer disposed on the active layer; a first gate layer disposed on the first gate insulating layer; a second gate insulating layer disposed on the first gate insulating layer and the first gate layer; and a second gate layer disposed on the second gate insulating layer. The array substrate of the present disclosure replaces molybdenum wires of a gate layer and a second gate layer with a multi-layered composite metal layer. The bending tolerance of gate wires in the display panel is enhanced and increase of impedance of the first gate layer is prevented.