Flexible OLED Panel Groove Anchoring for Adhesion
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Flexible OLED panels face issues with moisture and oxygen permeation due to peeling of inorganic and organic layers during bending, leading to display failures, as the current thin film encapsulation structure lacks sufficient adhesion and barrier effectiveness.
Innovation Solution
A flexible OLED panel design featuring a flexible substrate with a second organic layer having channels, a buffer layer with grooves, and a packaging layer that includes an organic packaging layer in contact with the substrate through the grooves, enhancing adhesion and oxygen/moisture barrier capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If thin film encapsulation (TFE) structure with inorganic and organic layers is used to enable flexible OLED panel bending, then flexibility is achieved, but adhesion between layers deteriorates causing peeling during bending
Solution Approach 1:
The patent introduces a groove structure that extends vertically into the organic layer, transforming a two-dimensional planar contact interface into a three-dimensional multi-surface contact interface. This dimensional change increases the contact area between packaging layer and substrate, improving adhesion while maintaining flexibility
Solution Approach 2:
The organic layer is segmented by introducing grooves that divide it into regions, creating increased surface area for contact with the packaging layer. This segmentation allows the packaging layer to anchor into the organic layer, preventing peeling while maintaining overall flexibility
2Object-affected harmful factors
If inorganic layers are used to block moisture and oxygen in TFE structure, then barrier function is provided, but stress from bending causes peeling at boundaries allowing moisture/oxygen permeation
Solution Approach 1:
The packaging layer with grooves creates a three-dimensional anchoring structure that prevents peeling at boundaries. This dimensional change ensures the barrier function remains intact during bending, preventing moisture and oxygen permeation that would cause display failure
Solution Approach 2:
The groove structure is pre-formed in the organic layer before final assembly, providing advance stress relief and adhesion enhancement. This preliminary structural preparation prevents peeling from occurring during subsequent bending operations, maintaining barrier integrity
3Manufacturing precision
If block walls are disposed near cutting line to prevent organic layer overflow, then manufacturing control is improved, but peeling occurs at block wall boundaries due to planar contact only
Solution Approach 1:
The groove structure transforms the boundary contact from a two-dimensional planar interface to a three-dimensional multi-surface interface. This allows the packaging layer to anchor vertically into the organic layer at block wall boundaries, preventing peeling while maintaining precise organic layer containment
Data Source
AI summary
The present invention provides a flexible organic light-emitting diode (OLED) panel, including: a flexible substrate which includes a channel; a buffer layer disposed on the second organic layer, the buffer layer including a buffer layer groove; a first block wall disposed on the buffer layer, the first block wall surrounding the buffer layer groove and defining a display region; a second block wall disposed on the buffer layer and over the channel, the second block wall surrounding the first block wall; and a packaging layer disposed in the display region, the packaging layer including an organic packaging layer, a portion of the organic packaging layer being disposed in the buffer layer groove and in contact with the flexible substrate.