Flexible OLED Insulation Layer Stress Isolation
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Solution Overview
Problem
Flexible organic light emitting devices face damage and inoperability due to inward compression stress and upward pulling stress during separation from carrier substrates, leading to peeling of film layers, which results in low yield and device characteristics.
Innovation Solution
A flexible light emitting device design featuring a flexible substrate with an organic light emitting unit and a covering substrate, where an insulation layer with an adhesive peeling force less than 0.1 N/cm is used between the organic light emitting unit and the covering substrate, preventing peeling and ensuring better yield and device characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a flexible substrate is adhered to a carrier substrate during fabrication, then the organic light emitting device can be manufactured on a flexible substrate, but inward compression stress and upward pulling stress are generated during separation, causing peeling of film layers
Solution Approach 1:
The patent introduces an insulation layer as a separate component between the organic light emitting unit and the covering substrate. This segmentation allows the insulation layer to act as a stress-isolating interface, preventing stress transmission from the covering substrate to the organic light emitting unit during substrate separation, thereby avoiding film layer peeling while maintaining manufacturability.
Solution Approach 2:
The insulation layer serves as an intermediary element between the organic light emitting unit and the covering substrate. With adhesive peeling force less than 0.1 N/cm, it mediates the interaction between these components, allowing easy separation without generating harmful stresses that would cause film layer peeling, thus preserving device integrity during manufacturing.
2Reliability
If the adhesive peeling force between the insulation layer and the organic light emitting unit is reduced to less than 0.1 N/cm, then peeling of the second electrode layer is prevented, but the insulation layer may not adhere sufficiently to the covering substrate
Solution Approach 1:
The patent applies different adhesion characteristics to different interfaces of the insulation layer. The interface between the insulation layer and the organic light emitting unit has low adhesion (peeling force < 0.1 N/cm) to prevent film layer peeling, while the interface between the insulation layer and the covering substrate maintains sufficient adhesion through the adhesion layer, ensuring structural stability without causing stress-induced peeling.
Solution Approach 2:
The adhesion layer acts as an intermediary between the insulation layer and the covering substrate, providing the necessary adhesion strength to hold the structure together while the insulation layer's low-adhesion interface with the organic light emitting unit prevents stress transmission. This dual-interface design resolves the contradiction between sufficient adhesion and stress prevention.
Data Source
AI summary
A flexible organic light emitting device includes a flexible substrate, an organic light emitting unit and a covering substrate. The organic light emitting unit includes a first electrode layer, a second electrode layer opposing the first electrode, and a light emitting layer, which is disposed between the first and second electrode layers. The covering substrate includes a base film, an insulation layer and an adhesion layer. An inner surface of the base film is facing an inner surface of the flexible substrate, and space is formed there-between. The insulation layer is disposed on the inner surface of the base film, and an adhesive force between the insulation layer and the organic light emitting unit is less than 0.1 N/cm. The adhesion layer is disposed between the insulation layer and the inner surface of the base film, covers the insulation layer and the organic light emitting unit, and fills the space.