Flexible OLED Display Structure for Mask-Minimized Bending
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Solution Overview
Problem
The manufacturing cost of flexible OLED devices increases due to the need for multiple mask processes to enhance bendability in bending sections, which complicates the production process.
Innovation Solution
A substrate structure for OLED devices is designed with a buffer layer, insulation layer structure, fan-out wiring, and connection electrodes to facilitate bending, reducing the need for additional mask processes while maintaining electrical connectivity and flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple mask processes are used to enhance bendability in bending sections, then the bendability of the OLED device is improved, but the manufacturing cost and process complexity increase
Solution Approach 1:
The patent applies preliminary action by pre-defining the bending region with reduced insulation layer thickness during the initial manufacturing process, before the device is assembled. This allows the bending section to be prepared in advance with the appropriate structural characteristics for flexibility, eliminating the need for additional mask processes later to enhance bendability.
Solution Approach 2:
The patent implements local quality by creating a bending region with different insulation layer thickness characteristics compared to other regions of the device. The insulation layer in the bending region has reduced thickness or is selectively removed, providing localized flexibility exactly where needed, while maintaining full insulation coverage in non-bending areas.
2Adaptability or versatility
If multiple mask processes are used to enhance bendability in bending sections, then the bendability of the OLED device is improved, but the manufacturing cost increases
Solution Approach 1:
The bending region structure is prepared in advance during the standard manufacturing process sequence, incorporating the flexibility features into the initial device construction. This eliminates the need for separate, costly post-assembly mask processes that would otherwise be required to create bendable sections.
Solution Approach 2:
The manufacturing process is designed to create a multi-functional structure where the insulation layer serves both its primary insulation function and simultaneously creates the bending region structure. By controlling the insulation layer thickness distribution during normal manufacturing, the process achieves both electrical insulation and mechanical flexibility without requiring additional specialized processing steps.
3Adaptability or versatility
If the insulation layer thickness is reduced in the bending region, then the flexibility of the OLED device is improved, but the insulation performance may be compromised
Solution Approach 1:
The patent applies local quality by creating spatially varying insulation layer thickness: the bending region has reduced thickness for flexibility, while other regions maintain full thickness for insulation performance. This localized differentiation ensures each region has the appropriate properties for its specific function.
Solution Approach 2:
The insulation layer thickness distribution is predetermined and established during the initial manufacturing process. The bending region structure is pre-formed with the appropriate thickness profile, ensuring both flexibility and insulation performance are built into the device from the start without requiring later modifications.
Data Source
AI summary
An OLED device includes a substrate having a display region including a pixel region and first and second peripheral regions surrounding the pixel region. A bending region is between the display region and the second peripheral region. A buffer layer has a first opening exposing an upper surface of the substrate. A plurality of pixel structures is disposed in the pixel region on the buffer layer. An insulation layer structure is disposed on the buffer layer. The insulation layer structure has a second opening exposing an upper surface of the substrate that is disposed in the bending region and a first portion of the buffer layer that is disposed adjacent to the bending region. A fan-out wiring is disposed between two adjacent insulation layers of the plurality of insulation layers. The fan-out wiring is disposed in the first peripheral region and/or the second peripheral region.