Flexible OLED Substrate Manufacturing via Carrier Separation
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Solution Overview
Problem
Current methods for manufacturing organic light emitting devices with flexible substrates are complex and costly, and existing glass substrates are heavy, fragile, and difficult to work with for large-area applications.
Innovation Solution
A method involving the formation of a polyimide layer on a carrier substrate, followed by a plastic substrate with enhanced adhesion using a silane coupling agent, allowing for the easy attachment and separation of the organic light emitting device, which simplifies the process and reduces costs while enabling flexible and large-area production.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If glass substrates are used for manufacturing organic light emitting devices, then structural stability is improved, but weight increases and flexibility is reduced
Solution Approach 1:
The patent replaces traditional glass substrates with flexible plastic substrates (such as polyimide films) that enable the organic light emitting device to be lightweight, thin, and flexible. This substitution directly addresses the contradiction by eliminating the heavy glass structure while maintaining device functionality through alternative flexible material construction.
2Stability of the object's composition
If glass substrates are used for manufacturing organic light emitting devices, then structural stability is improved, but ease of operation deteriorates due to fragility
Solution Approach 1:
The patent employs flexible plastic substrates instead of brittle glass substrates, transforming the device from fragile and difficult to handle into flexible and easy to manipulate. The flexible nature of the plastic substrate eliminates the handling difficulties associated with glass while maintaining structural integrity for device operation.
3Ease of manufacture
If conventional manufacturing methods are used for flexible substrates, then ease of manufacture is improved, but device complexity increases due to additional carrier substrate layers
Solution Approach 1:
The patent removes the complex multi-layer carrier substrate structure from the final device configuration. By using flexible plastic substrates that can directly serve as the device substrate without requiring separate carrier substrates for manufacturing support, the invention simplifies the overall device structure while maintaining ease of manufacture through conventional flexible substrate fabrication processes.
4Area of stationary object
If flexible substrates are used for large-area light emission, then area of emission is improved, but uniformity of current injection deteriorates
Solution Approach 1:
The patent addresses current injection uniformity in large-area flexible devices by optimizing electrical parameters such as electrode configuration, conductivity distribution, and interface properties between layers. These parameter adjustments ensure uniform current flow across the expanded flexible substrate area, enabling large-area emission while maintaining manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces process costs and enables the production of flexible organic light emitting devices with improved adhesion and ease of separation, overcoming the limitations of glass substrates and enabling efficient large-area light emission.
Implementation Method 1
a plastic substrate having a wider area than that of the polyimide layer, wherein the plastic substrate is attached on the carrier substrate and the polyimide layer
Implementation Method 2
uses a phenomenon in which electric energy is converted into light energy by using an organic material, that is, an organic light emitting phenomenon
Data Source
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AI summary
The present application relates to an organic light emitting device including a flexible substrate, and a preparing method thereof, and the method includes: 1) forming a polyimide layer on a carrier substrate; 2) forming a plastic substrate on the carrier substrate and the polyimide layer; 3) forming an organic light emitting device on the plastic substrate; and 4) separating the carrier substrate.