Flexible OLED Substrate Shaping with Glass Encapsulation
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Solution Overview
Problem
Conventional organic light emitting diodes (OLEDs) manufactured on glass substrates cannot be bent due to the high temperatures required to shape glass, which would damage the organic layers, limiting their ability to be formed into curved or complex shapes.
Innovation Solution
A light emitting diode device is created using a flexible substrate, such as a foil, that can be shaped three-dimensionally, encapsulated between glass sheets to form a sealed and durable structure, allowing for the creation of curved or complex shapes without damaging the OLED layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If glass substrate is used to protect OLED from moisture and oxygen, then reliability and protection are improved, but the ability to bend and shape the device is lost
Solution Approach 1:
The device is divided into two separate functional parts: a flexible substrate carrying the OLED that can be bent and shaped, and a glass encapsulation layer that provides moisture and oxygen protection. These segments are connected through a sealing structure, allowing each part to fulfill its specific function without compromising the other.
Solution Approach 2:
The invention replaces the traditional rigid glass substrate with a flexible foil substrate that can be bent and shaped into various configurations. The glass encapsulation is applied as a separate thin film or layer that conforms to the flexible substrate's shape, maintaining protection while enabling flexibility.
2Shape
If high temperatures are applied to shape glass, then the glass can be formed into desired shapes, but the organic layers of the OLED are destroyed
Solution Approach 1:
The flexible substrate and OLED are shaped and positioned before the glass encapsulation is applied. The glass is then sealed to the pre-formed flexible substrate, eliminating the need to heat the glass after the OLED is in place. This sequence ensures the organic layers are never exposed to melting temperatures.
Solution Approach 2:
The invention changes the thermal parameter of the substrate material from high melting point (glass) to low melting point/flexible material (foil). This allows the substrate to be shaped at low temperatures compatible with OLED organic layers, while the glass encapsulation provides protection without requiring post-assembly heating.
3Adaptability or versatility
If flexible foil substrate is used to enable bending and shaping, then adaptability and shape freedom are improved, but mechanical stability and protection are reduced
Solution Approach 1:
The device combines a flexible foil substrate with a rigid glass encapsulation layer to create a composite structure. The flexible substrate provides bendability and shape adaptability, while the glass layer provides mechanical strength, rigidity, and environmental protection. The combination achieves properties that neither material could provide alone.
Solution Approach 2:
The invention merges the advantages of flexible substrates (bendability, shape freedom) with the advantages of glass encapsulation (protection, mechanical stability) into a single integrated device structure. The sealing structure combines both materials to create a unified system that delivers both flexibility and protection simultaneously.
Data Source
AI summary
The invention relates to a light emitting diode device comprising a light emitting diode arrangement comprising a flexible substrate (103) having an inner surface and an outer surface, and a light emitting diode (101) arranged on the inner surface of the flexible substrate (103) and a shape element (105, 107) at least partly covering the outer surface of the flexible substrate (103) and a surface of the light emitting diode (101) so as to at least partly sandwich the light emitting diode arrangement, the shape element (105, 107) being formed to determine a shape of the light emitting diode arrangement.