Flexible OLED Substrate Manufacturing via Glass Carrier Separation
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Solution Overview
Problem
Current methods for manufacturing flexible organic light emitting devices face challenges such as substrate bending, surface roughness, and defects due to dust formation, which hinder the production of large-scale devices with high reliability and longevity.
Innovation Solution
A method using a glass mother substrate with a polymer layer formed via chemical vapor deposition or vacuum evaporation, where the device is formed and then separated from the substrate, ensuring a flexible and stress-free structure by using parylene as the polymer material, which is weakly bonded to the glass, preventing dust and surface roughness issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a rigid substrate is used for manufacturing, then manufacturing precision and stability are improved, but flexibility and wearability are worsened
Solution Approach 1:
The substrate material transitions from rigid to flexible by changing its physical parameters, enabling the substrate to maintain dimensional stability during manufacturing while adapting to curved surfaces during application. This parameter change resolves the contradiction between manufacturing precision and flexibility.
2Device complexity
If conventional alignment methods are used on flexible substrates, then device complexity is reduced, but alignment precision deteriorates due to substrate deformation
Solution Approach 1:
Alignment marks are formed on the flexible substrate before the bonding process, ensuring that alignment references are established when the substrate is still in a stable, flat state. This preliminary action prevents alignment errors that would occur if marks were formed after substrate deformation, resolving the contradiction between device complexity and alignment precision.
3Adaptability or versatility
If multiple separate manufacturing processes are used for different components, then manufacturing flexibility is improved, but productivity and time consumption are worsened
Solution Approach 1:
The patent combines multiple manufacturing steps into a single integrated process where the flexible substrate serves as a common platform for forming alignment marks, bonding electrodes, and assembling components. This merging of processes maintains manufacturing flexibility while significantly improving productivity by eliminating sequential processing steps.
4Stability of the object's composition
If rigid substrates are used for OLED manufacturing, then structural stability is improved, but wearability and comfort are worsened
Solution Approach 1:
The substrate undergoes a parameter change from rigid to flexible, allowing it to provide structural stability during manufacturing while conforming to body contours during wear. This parameter transformation resolves the contradiction between structural stability and wearability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the production of large-scale flexible organic light emitting devices with improved durability and reduced stress, allowing for successful commercialization by preventing substrate bending and surface defects, and ensuring the device operates normally even when bent.
Implementation Method 1
a polymer layer, which is used as a substrate, is formed on the mother substrate using a chemical vapor deposition or a vacuum evaporation method
Implementation Method 2
a polymer layer, which is used as a substrate, is formed on the mother substrate using a chemical vapor deposition or a vacuum evaporation method
Data Source
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AI summary
The present invention relates to a method of manufacturing a device having a flexible substrate and a device having a flexible substrate manufactured using the method. According to the method of manufacturing a device having a flexible substrate of the invention, glass is used as a mother substrate, a polymer layer, which is used as a substrate, is formed on the mother substrate using a chemical vapor deposition method or a vacuum evaporation method, a device is formed, and finally, the substrate where the device is formed is separated from the mother substrate, such that a large-scale device having a flexible substrate can be manufactured. Further, as a substrate forming an organic light emitting device and a sealant are formed of the same material, the device is not bent due to stress generated from the device itself after the device is manufactured.