Flexible OLED Device Substrate Etching and Multi-Layer Seal

The patent applies preliminary action by etching the substrate to the target thickness range (0.05-0.2mm) before the OLED device is fully assembled. This allows the substrate to be pre-prepared with optimal flexibility characteristics, and then subsequent layers are formed on top. The etching is performed in advance while the substrate can still be easily handled and positioned in manufacturing equipment, avoiding the difficulty of manipulating ultra-thin substrates during later assembly steps.

The patent employs composite materials by combining the etched substrate with multiple functional layers including planarization layers, buffer layers, and encapsulation layers. The substrate itself may also be a composite structure providing both flexibility and strength. This composite approach allows the thin substrate to maintain adequate mechanical strength while achieving the required flexibility for bending applications.

The patent applies parameter changes by carefully controlling the thickness parameter of the plastic substrate within the 0.05-0.2mm range, and by selecting substrates with specific thermal properties. Additionally, the manufacturing process parameters are optimized to account for the temperature sensitivity of plastic substrates, including controlling deposition temperatures and curing conditions to prevent substrate deformation or degradation during device fabrication.

The patent applies segmentation by implementing a multi-layer encapsulation structure that divides the protection function into multiple separate layers. Each layer provides a barrier against moisture and oxygen, and the combined effect of multiple thin layers is more effective than a single thick layer. This segmented approach maintains overall device thinness while providing robust protection against harmful environmental factors.