Flexible Optical Circuit Adhesive Mounting

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Solution Overview

Problem

The existing flexible optical circuits face challenges in secure installation without bulky mechanical devices, particularly in space-constrained environments, where traditional methods require additional components like clips for fixation.

Innovation Solution

A flexible optical circuit with an adhesive bottom surface that can be readily affixed to a surface during installation, manufactured by disposing an adhesive layer on a carrier film, routing fibers on the adhesive layer, and applying a conformal coating, allowing the circuit to be securely attached without mechanical devices.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional mechanical devices (clips) are used to secure optical circuits, then the optical circuits can be held in place, but the space requirements increase and the installation becomes more complex

Engineering Contradiction:
Improvesecuring optical circuitVSAvoidinstallation space
Core Design Contradiction:
ReliabilityVSArea of stationary object

Solution Approach 1:

The patent replaces mechanical fastening devices (clips, screws) with an adhesive system. The adhesive layer is applied to the carrier film and bonds the optical circuit directly to the mounting surface, eliminating the need for mechanical hardware and reducing installation space requirements.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent combines the carrier film and adhesive into a single integrated structure. The adhesive layer is disposed directly on the carrier film, merging the support function of the carrier with the bonding function of the adhesive, thereby eliminating separate mechanical fastening components.

Inventive Principle:
Principle #5Merging (Combining)

2Reliability

If mechanical fastening devices are used to secure optical circuits, then the optical circuits can be fixed in place, but the device complexity increases

Engineering Contradiction:
Improvesecuring optical circuitVSAvoidinstallation components
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent substitutes mechanical fastening systems with a chemical bonding system (adhesive). This replacement simplifies the overall device by eliminating multiple mechanical components (clips, screws, mounting brackets) and reducing installation complexity to a simple adhesive bonding process.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent extracts and removes the mechanical fastening devices from the optical circuit assembly. By eliminating clips, screws, and other mechanical hardware, the patent reduces device complexity while maintaining the essential function of securing the optical circuit in place.

Inventive Principle:
Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables secure and space-efficient installation of optical circuits by eliminating the need for bulky mechanical fasteners, enhancing cable management and reducing operational complexity in dense infrastructure setups.

Implementation Method 1

a flexible optical circuit with an adhesive bottom surface that can be readily affixed to a surface during installation

Methodology Applied
Scientific EffectAdhesive bonding: Adhesive

Data Source

PatentEP2748661B1Flexible optical circuit
Publication Date: 2022.08.17 TE CONNECTIVITY NEDERLAND
  • EP2748661B1 patent drawingFigure 1
  • EP2748661B1 patent drawingFigure 2~3
  • EP2748661B1 patent drawingFigure 4

AI summary

A process of manufacturing an optical flexible circuit (500) comprising: (a) disposing an adhesive layer (502) on at least a portion of a carrier film (501), said adhesive layer having a downward adhesive face and an upward adhesive face, said downward adhesive face and said carrier film being configured such that said carrier film is removable from said downward adhesive face without disruption of said downward adhesive face; (b) routing one or more fibers (503) on said upward adhesive layer; (c) coating (504) said fibers to define an optical circuit; and (d) optionally parting said carrier film to separate said optical circuit from other optical circuits on said carrier film.