Flexible Opto-Electric Interconnect for RF Noise Immunity
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Solution Overview
Problem
Portable devices face data corruption due to RF noise interference with low amplitude electrical signals used for high data rate transmissions, such as streaming video, which is not effectively addressed by existing technologies.
Innovation Solution
An opto-electric flex interconnect with integrated electrical-to-optical and optical-to-electrical interfaces on a flexible substrate, allowing for the transmission of high-speed data without bulky optical connectors, and using optical waveguides for immunity to RF noise, while power and control signals are transmitted via electrical wires.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If low amplitude electrical signals are used for high data rate transmissions, then data transfer rate is improved, but susceptibility to RF noise corruption increases
Solution Approach 1:
The patent replaces electrical signal transmission with optical signal transmission through waveguides. Optical signals are immune to RF noise interference that corrupts electrical signals, thereby maintaining high data transfer rates while eliminating susceptibility to electromagnetic interference in wireless portable devices
Solution Approach 2:
The patent changes the physical parameter of signal transmission from electrical to optical domain. By converting electrical signals to optical signals for data transmission, the system achieves immunity to RF noise while maintaining high bandwidth capabilities, resolving the contradiction between data rate and signal reliability
2Reliability
If optical links are used for high bandwidth applications, then immunity to RF noise is improved, but device complexity and cost increase due to need for optical connectors
Solution Approach 1:
The patent merges optical waveguides directly with the flexible printed circuit board substrate, integrating the optical transmission medium into the existing electrical circuit board structure. This eliminates the need for separate optical connectors and their associated alignment mechanisms, reducing device complexity while maintaining optical transmission benefits
Solution Approach 2:
The flexible substrate serves dual functionality as both the mechanical support for electrical circuits and the integration platform for optical waveguides. This multi-functional design allows optical and electrical interconnects to share the same substrate, eliminating the need for separate connector assemblies and reducing overall system complexity
3Ease of operation
If optical waveguides are integrated on flexible substrate, then ease of installation is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent incorporates alignment features and coupling structures directly into the flexible substrate and waveguide assembly during manufacturing. These pre-integrated alignment mechanisms ensure precise optical coupling when the device is assembled, eliminating the need for complex field alignment procedures while maintaining manufacturing feasibility
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables reliable, high-speed data transmission with reduced susceptibility to RF noise, eliminating video errors and improving signal fidelity, especially in high-density electronic environments, without the need for expensive optical connectors.
Implementation Method 1
one or more waveguides mounted on a flexible substrate. The one or more waveguides are configured to transmit optical signals
Implementation Method 2
One or more conversion devices for converting between electrical and optical signals are arranged on the flexible interconnect assembly
Data Source
AI summary
One embodiment of the present invention includes a flexible interconnect assembly that can convert between optical and electrical signals and that is configured to be easily secured to an electrical device, such as a printed circuit board or integrated circuit chip. The flexible interconnect assembly includes a flexible substrate and one or more optical waveguides that are mounted on the flexible interconnect and suitable for transmitting optical signals. One or more conversion devices for converting between electrical and optical signals are arranged on the flexible substrate. The flexible interconnect assembly optionally includes an attachment fixture that enables the flexible substrate to be reversibly coupled to an attachment apparatus. Particular embodiments of the present invention involve methods, devices and systems for using a flexible interconnect assembly with one or more electronic substrates configured with an attachment apparatus.


