Flexible Optoelectronic Interconnect Structure for Extendable Lighting
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Solution Overview
Problem
Existing optoelectronic components lack extensibility, limiting their adaptability to various applications and geometries.
Innovation Solution
An optoelectronic component comprising flexible and extensible semiconductor chips and connecting elements, surrounded by a flexible polymeric shaped body, allowing for reversible deformation and length adjustment, enabling the component to be bent, extended, or compressed without damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If traditional rigid optoelectronic components are used, then structural stability is maintained, but adaptability to different geometries and applications is limited
Solution Approach 1:
The patent applies the dynamics principle by making the connecting elements and shaped body flexible and extensible, allowing the optoelectronic component to dynamically adapt its shape and size. The connecting elements can be elastically or plastically deformed, and the shaped body can be reversibly deformed, enabling the component to conform to different geometries while maintaining structural integrity through elastic recovery or controlled plastic deformation.
Solution Approach 2:
The patent implements flexible shells and thin films by using a shaped body made of polymeric material that is flexible and extensible. This shaped body surrounds the connecting elements and semiconductor chips, providing a flexible enclosure that allows the entire component to be bent and deformed without breaking, thus achieving adaptability to different geometries while maintaining protective enclosure.
2Adaptability or versatility
If fixed-length connecting elements are used, then manufacturing precision is maintained, but extensibility and adaptability are reduced
Solution Approach 1:
The connecting elements are designed with dynamic length characteristics, being elastically or plastically extensible rather than fixed. This allows the length to be adjusted after manufacturing to fit different application requirements, sacrificing strict length precision during manufacturing in exchange for post-manufacturing adaptability and extensibility.
Solution Approach 2:
The patent applies parameter changes by allowing the connecting elements to change their physical state between elastic and plastic deformation. This enables the length parameter to be modified after manufacturing through controlled deformation, achieving extensibility while maintaining acceptable manufacturing precision through tolerance ranges.
3Adaptability or versatility
If rigid connecting elements are used, then electrical connection reliability is maintained, but flexibility and bendability are lost
Solution Approach 1:
The connecting elements are designed as flexible conductive structures that can be bent and deformed without breaking. These flexible connecting elements maintain electrical connection reliability through their ability to elastically recover or plastically deform within tolerance ranges, preventing connection failure while enabling flexibility for different geometries and applications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The component can be adapted to different sizes and geometries, making it suitable for diverse applications, including flexible uses like garments and complex lighting fixtures, while maintaining functionality by allowing electromagnetic radiation to exit in multiple directions.
Implementation Method 1
The optoelectronic semiconductor chips are designed to emit electromagnetic radiation during operation. The optoelectronic semiconductor chips are, for example, luminescent diode chips such as light-emitting diode chips or laser diode chips.
Implementation Method 2
The connecting element can be deformed, bent or flexed in different directions. The connecting element can be deformed both plastically and elastically.
Implementation Method 3
The connecting element can be deformed both plastically and elastically. Thus, the connecting element can be bendable or curvable.
Implementation Method 4
the shaped body may be transparent to electromagnetic radiation emitted from the optoelectronic semiconductor chips
Data Source
AI summary
The invention relates to an optoelectronic component, comprising: at least two optoelectronic semiconductor chips, which are designed to emit electromagnetic radiation during operation; at least one connecting element, which is electrically conductive, flexible and extensible; and a shaped body, which surrounds the at least two optoelectronic semiconductor chips and the at least one connecting element at least in some locations, wherein the optoelectronic semiconductor chips are each arranged on a carrier. The invention further relates to a method for producing an optoelectronic component.