Flexible Organic Electronic Device Barrier System
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing organic electronic devices, such as OLEDs, face challenges in achieving effective encapsulation due to the inability to utilize high energy and high temperature processes for densifying barrier layers without damaging the devices, and flexible substrates have limited processing temperatures, making it difficult to create robust moisture and oxygen barriers.
Innovation Solution
A method involving the formation of a flexible organic electronic device by separately forming a barrier system under different conditions than the organic electronic device region, allowing for the decoupling of OLED deposition from barrier deposition in a roll-to-roll process, and using a multilayer or single-layer barrier system to encapsulate the device without exposing it to ambient atmosphere, thereby preventing damage from high energy or oxidative processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If high energy and high temperature processes are used to densify barrier layers, then barrier properties are improved, but the organic electronic device is damaged
Solution Approach 1:
The manufacturing process is divided into two separate portions: a first portion for forming the barrier system under high energy/high temperature conditions, and a second portion for forming the organic electronic device under milder conditions. This segmentation allows each portion to be optimized independently, enabling the barrier layers to be densified effectively without exposing the organic device to damaging conditions.
Solution Approach 2:
The barrier system is formed in advance as a separate first portion before the organic electronic device is deposited. By preparing the barrier layers beforehand under optimal high energy conditions, the device can then be deposited separately and combined without exposing it to harmful high energy or high temperature processes.
2Adaptability or versatility
If flexible substrates are used, then device flexibility is improved, but processing temperature is limited
Solution Approach 1:
The process is segmented into separate portions where the barrier system is formed first under controlled conditions suitable for flexible substrates, and the organic device is deposited separately. This allows the use of flexible substrates without requiring high temperature processing that would damage the substrate or device.
3Ease of manufacture
If decoupling of OLED deposition from barrier deposition is implemented, then manufacturing flexibility is improved, but process complexity increases
Solution Approach 1:
The manufacturing process is divided into distinct first and second portions that can be formed separately and then combined. This segmentation provides manufacturing flexibility by allowing independent optimization of each portion and enabling different deposition methods to be used, while the modular nature actually simplifies overall process control compared to attempting simultaneous deposition.
Solution Approach 2:
A separate barrier system portion acts as an intermediary layer that can be formed independently and then combined with the organic device. This intermediary approach allows each component to be optimized separately using the most appropriate deposition techniques for each material type.
Data Source
AI summary
A method of making a flexible organic electronic device includes forming a first portion including a first flexible substrate, wherein the first portion is formed under a first set of conditions to provide a barrier system, separately forming a second portion comprising at least one organic electronic device region deposited upon a second flexible substrate, wherein the second portion is formed under a second set of conditions, different from the first set of conditions, and placing the first portion over the second portion (although not necessarily in contact therewith) to cover the organic electronic device region. The organic electronic device region is not placed in physical contact with another solid material before placing the first portion over the second portion.