Flexible Electronic Package Structure With Modulus-Graded Protection
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Solution Overview
Problem
Conventional encapsulant materials used in electronic device packaging are rigid, limiting the flexibility and application of package devices.
Innovation Solution
Incorporating a flexible member with a lower Young's modulus into the electronic device design, surrounded by a protection layer with a higher Young's modulus, allowing for a bendable or flexible structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a rigid encapsulant material is used to protect electronic units, then the protection and reliability are improved, but the flexibility and bendability of the package device deteriorate
Solution Approach 1:
The protection layer is divided into multiple regions: a first region with higher Young's modulus for protecting electronic units, and a second region with lower Young's modulus for enabling flexibility. This segmentation allows different parts of the same protection layer to serve different functions simultaneously.
Solution Approach 2:
Different regions of the protection layer are assigned different material properties (Young's modulus values) to fulfill different functional requirements locally. The first region provides rigidity for protection, while the second region provides flexibility for bending, achieving local optimization of material properties.
2Strength
If a rigid encapsulant material is used to protect electronic units, then the strength and durability are improved, but the ability to be bent or flexed deteriorates
Solution Approach 1:
The protection layer is segmented into regions with different mechanical properties. The first region maintains high strength for protection, while the second region allows bending by having lower rigidity, resolving the contradiction between strength and shape adaptability.
Solution Approach 2:
The protection layer functions as a composite structure with regions of different Young's modulus, combining the properties of rigidity and flexibility within a single protective layer, thereby achieving both strength and bendability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enables the electronic device to be bent or flexed, providing improved application flexibility and protection for internal components.
Implementation Method 1
The protection layer has a first Young's modulus, the flexible member has a second Young's modulus, and the first Young's modulus is greater than the second Young's modulus
Data Source
AI summary
The present disclosure provides an electronic device including a first electronic unit, a second electronic unit, a circuit layer, a protection layer, and a flexible member. The first electronic unit is electrically connected to the second electronic unit through the circuit layer. The protection layer is disposed corresponding to the first electronic unit and the second electronic unit, and the protection layer has an opening. At least a portion of the flexible member is disposed in the opening. The protection layer has a first Young's modulus, the flexible member has a second Young's modulus, and the first Young's modulus is greater than the second Young's modulus.