Flexible Package Structure With Directed Underfill Flow
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In package structures, underfill material often overflows onto bent portions, reducing the flexibility of the packaging structure after curing, as it migrates and accumulates in areas not intended, leading to delamination and loss of pliability.
Innovation Solution
A packaging structure with a trench in the carrier substrate, featuring a directing structure that guides the underfill material to prevent migration and overflow, enhancing adhesion and maintaining flexibility by confining the material within the trench, thereby reducing delamination and allowing for higher excessive material dispensing without loss of pliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If underfill material is dispensed to fill the gap between substrates, then adhesion and structural integrity are improved, but material overflows onto bent portions reducing flexibility
Solution Approach 1:
The gap is divided into a first region and a second region separated by a directing structure. The directing structure segments the flow path, allowing underfill material to be contained in the first region while preventing migration to the second region, thus maintaining flexibility in bent portions.
Solution Approach 2:
The directing structure acts as an intermediary element between the first and second regions. It guides the underfill material flow and prevents direct contact between the material and the bent portion, resolving the conflict between adhesion needs and flexibility requirements.
2Reliability
If excessive underfill material is dispensed, then adhesion enhancement is improved, but material migration causes delamination
Solution Approach 1:
The directing structure is pre-formed on the carrier before underfill material dispensing. This preliminary structure guides the material flow and prevents migration, allowing excessive material to be dispensed without causing delamination, as the directing structure contains it within the first region.
Solution Approach 2:
The harmful migration of underfill material is extracted or prevented by the directing structure. The material is taken out of the flow path that would lead to bent portions, confining it to the first region where it provides adhesion without causing delamination.
3Adaptability or versatility
If the package structure is designed to be flexible, then adaptability is improved, but underfill material overflow reduces the flexibility
Solution Approach 1:
The directing structure introduces local complexity only where needed - in the gap region between substrates. The rest of the package structure remains simple and flexible. This localized approach maintains overall flexibility while preventing material overflow in critical areas.
Data Source
AI summary
A package structure is disclosed. The package structure includes a first substrate, a second substrate, a gap, and a directing structure. The second substrate is disposed under the first substrate. The gap is between the first substrate and the second substrate. The gap includes a first region and a second region. The first region is configured to accommodate a filling material. The directing structure is disposed in a flow path of the filling material and configured to reduce a migration of the filling material from the first region to the second region.