Flexible Package Design for Warped Semiconductor Chips
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Solution Overview
Problem
Semiconductor packages with warped chips face electrical connection failures due to warpage, requiring compensation processes to ensure reliability.
Innovation Solution
A flexible package design incorporating a flexible molding member with embedded chips, where the chips are positioned to have bent edges forming smile or crying shapes, allowing for electrical connection structures that maintain contact despite warpage, and supported by connectors to ensure reliable connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If semiconductor chips are fabricated with reduced thickness to enable smaller electronic systems, then the size and weight of electronic systems are reduced, but the chips develop warped shapes that cause electrical connection failures
Solution Approach 1:
The patent applies this principle by using a flexible molding member that can deform to accommodate the warped shape of the chip. The molding member acts as a flexible shell that conforms to the chip's non-planar surface, maintaining electrical connection reliability despite the chip's reduced thickness and inherent warpage.
Solution Approach 2:
The patent applies this principle by making the molding member flexible rather than rigid, allowing it to dynamically adapt its shape to match the chip's warpage. This dynamic flexibility enables the package to maintain reliable electrical connections while accommodating the chip's deformed state.
2Ease of manufacture
If a warped semiconductor chip is attached to another semiconductor chip or package substrate, then the chip can be integrated into the package, but electrical connection failure occurs due to the warped shape
Solution Approach 1:
The flexible molding member serves as a compliant interface that accommodates the warped chip shape during integration. By conforming to the chip's non-planar surface, it enables successful attachment to other components while maintaining reliable electrical connections throughout the package.
Solution Approach 2:
The patent applies this principle by changing the physical state of the molding member from rigid to flexible, allowing it to adapt its shape parameters to match the chip's warpage. This parameter change enables the molding member to maintain optimal contact and electrical connection reliability despite the chip's deformed geometry.
3Stability of the object's composition
If a rigid molding member is used to hold chips, then the package structure is stable, but it cannot accommodate chip warpage and causes connection failures
Solution Approach 1:
The patent applies this principle by transitioning from a rigid to a flexible molding member, enabling the package structure to dynamically adapt to chip warpage while maintaining overall stability. The flexibility allows the molding member to conform to the chip's shape without compromising the structural integrity of the package.
Solution Approach 2:
The flexible molding member acts as a compliant shell that can deform to accommodate chip warpage while maintaining package stability. This flexible shell design provides both the adaptability needed for warped chips and the structural stability required for reliable package performance.
Data Source
AI summary
A flexible package may be provided. The flexible package may include a flexible molding member including a top surface. The flexible package may include a first chip within the flexible molding member, and including a first top surface. The flexible package may include a second chip within the flexible molding member, and including a second top surface. The first top surface may face away from the top surface of the flexible molding member and the second top surface may face towards the top surface of the flexible molding member.