Flexible Packaging Thin Film via Electrostatic Layering
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Solution Overview
Problem
Conventional packaging methods for organic light emitting devices, such as glass packaging and vacuum deposition of thin films, result in thick and rigid devices that are difficult to apply on curved surfaces and are costly, while also requiring expensive equipment.
Innovation Solution
A method of manufacturing a package thin film involving pretreatment of a substrate with positive or negative charges, followed by immersion in nano material and moisture absorbent solutions to form alternately stacked layers, which are then sealed using a self-assembly process, eliminating the need for vacuum devices and allowing for flexible and cost-effective large-area manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If package glass is used for packaging, then water and oxygen blocking function is achieved, but device thickness increases and flexibility is reduced
Solution Approach 1:
The patent replaces rigid package glass with flexible thin film packaging layers, including organic light-emitting layer, inorganic barrier layer, and encapsulation layer. These thin films maintain water and oxygen blocking functionality while enabling device flexibility and curved surface application.
Solution Approach 2:
The patent employs composite packaging structure combining multiple materials: organic light-emitting materials, inorganic barrier materials (such as aluminum oxide, silicon oxide), and encapsulation materials. This composite approach achieves effective moisture and oxygen blocking while maintaining thin profile and flexibility.
2Reliability
If package glass with additional moisture absorbent is used, then water and oxygen blocking is improved, but device thickness and complexity increase
Solution Approach 1:
The patent integrates moisture absorption function directly into the packaging thin film structure itself, rather than adding separate moisture absorbent components. The inorganic barrier layer and encapsulation layer work together to provide both blocking and moisture management functions, simplifying device structure.
3Adaptability or versatility
If vacuum deposition method is used for thin film packaging, then flexibility and reduced thickness are achieved, but manufacturing cost increases due to expensive equipment
Solution Approach 1:
The patent replaces expensive vacuum deposition equipment with solution-based processing methods. The inorganic barrier layer and organic layers are deposited from aqueous or organic solutions through dip-coating, spray-coating, or spin-coating techniques, eliminating the need for high-vacuum systems while achieving comparable or superior film quality.
Solution Approach 2:
The patent utilizes liquid solutions (aqueous or organic) as the medium for depositing packaging layers, replacing gas-phase vacuum deposition. The solutions contain dissolved inorganic and organic materials that are deposited onto the substrate through liquid handling techniques, enabling low-cost manufacturing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method produces a thin, flexible package film that effectively blocks water and oxygen, enabling application on flexible devices and reducing manufacturing costs by simplifying the process and eliminating the need for expensive vacuum equipment.
Implementation Method 1
performing pretreatment to a substrate, thereby a surface thereof being provided with positive charges or negative charges
Implementation Method 2
immersing the pretreated substrate in a nano material solution with contrary charges with respect to those in the step S1 or in a solution of polycation organic material provided the pretreated substrate carriers negative charges
Implementation Method 3
constructing the package thin film through a simple immersion method... performing self assembly of each layer according to the principle of layered assembly
Implementation Method 4
the moisture absorbent is a montmorillonite solution... forming a moisture absorption layer attached on the nano material layer
Data Source
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AI summary
A package thin film and a manufacturing method thereof, a light emitting device, a display panel and a display device are provided. The package thin film may comprise: a nano material layer or a polycation organic material layer, a moisture absorption layer formed on the nano material layer or the polycation organic material layer, a sealing layer for sealing the nano material layer or the polycation organic material layer and the moisture absorption layer. The package structure provided by embodiments of the present invention is formed by alternate assembly of materials (the nano material layer or the polycation organic material layer and the moisture absorption layer) with different charges.