Flexible Packaging Ionomer Adhesive Pinhole Resistance

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Solution Overview

Problem

Conventional packaging materials using a paper substrate lack sufficient pinhole resistance, especially when bent, which compromises the protection of contents.

Innovation Solution

A laminated product for flexible packaging is developed, featuring a paper substrate layer, an adhesive layer containing an ionomer of an ethylene-unsaturated carboxylic acid copolymer with specific metal ion content, a barrier layer, and a sealant layer, which enhances pinhole resistance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If a paper substrate is used in flexible packaging materials, then environmental burden is reduced and resource conservation is promoted, but pinhole resistance deteriorates especially when bent

Engineering Contradiction:
Improveenvironmental burdenVSAvoidpinhole resistance
Core Design Contradiction:
Object-affected harmful factorsVSReliability

Solution Approach 1:

The patent applies composite materials by creating a laminated structure consisting of a paper substrate layer, adhesive layer, barrier layer, and sealant layer. This composite structure combines the environmental benefits of paper with the functional properties of plastic layers, achieving both reduced environmental burden and improved pinhole resistance through the coordinated action of multiple materials.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent uses an adhesive layer containing a specific ionomer as an intermediary between the paper substrate and barrier layer. This intermediary layer with controlled metal ion content (4.0-20.0 X×Y/100) serves as a bridge that enhances the overall pinhole resistance of the laminated structure while maintaining the paper substrate's environmental advantages.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Ease of manufacture

If conventional adhesive layers are used in paper-based laminated packaging, then manufacturing is simplified, but pinhole resistance under bending stress is insufficient

Engineering Contradiction:
Improvelaminating processVSAvoidpinhole resistance
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent applies parameter changes by precisely controlling the metal ion content in the ionomer adhesive layer within the range of 4.0-20.0 X×Y/100, where X is the unsaturated carboxylic acid content and Y is the degree of neutralization. This parameter optimization enhances pinhole resistance while maintaining manufacturability through standard extrusion coating processes.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS12240217B2Laminated product for flexible packaging, flexible packaging material, and flexible package
Publication Date: 2025.03.04 DOW MITSUI POLYCHEMICALS CO LTD

AI summary

A laminated product for flexible packaging is provided, in which at least a paper substrate layer, an adhesive layer, a barrier layer, and a sealant layer are laminated in this order, the adhesive layer contains an ionomer (A) of an ethylene-unsaturated carboxylic acid copolymer, and a content of metal ions represented by X×Y/100 is equal to or more than 4.0 and equal to or less than 20.0 when a content of unsaturated carboxylic acid in an ethylene-unsaturated carboxylic acid copolymer (A1) constituting the ionomer (A) of the ethylene-unsaturated carboxylic acid copolymer is X [mass %], and a degree of neutralization of the ionomer (A) of the ethylene-unsaturated carboxylic acid copolymer is Y [mol %].