Flexible Padded PCB Encasing for Comfortable Garment Monitoring
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Solution Overview
Problem
Existing wearable monitoring devices for body functions are bulky, stiff, and uncomfortable, making them difficult to integrate into clothing, especially undergarments, and they lack efficient integration with flexible materials.
Innovation Solution
A padded, flexible encasing for body monitoring systems in fabrics, incorporating a circuit board sandwiched between padding layers and protected by fabric layers, with integrated sensors and a wireless communication system, allowing seamless integration into garments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wearable monitoring devices use traditional rigid structures, then device stability and protection are improved, but comfort and ease of integration into clothing deteriorate
Solution Approach 1:
The patent applies flexible encasing materials including fabric layers, foam padding, and flexible circuit boards to replace traditional rigid device structures. The fabric layers (outer and inner) with integrated foam padding create a flexible yet protective enclosure that conforms to body contours and integrates seamlessly into clothing, eliminating the discomfort associated with rigid wearable devices while maintaining structural integrity and device protection.
Solution Approach 2:
The patent employs composite material construction by combining multiple materials with different properties: fabric layers for flexibility and comfort, foam padding for cushioning and structural support, flexible circuit boards for electrical connectivity, and adhesive layers for bonding. This composite approach allows the device to simultaneously achieve the stability needed for reliable monitoring and the flexibility required for comfort and clothing integration.
2Ease of operation
If wearable monitoring devices are made flexible and integrated into fabrics, then comfort and ease of integration into clothing are improved, but device protection and structural stability deteriorate
Solution Approach 1:
The patent implements a nested layer structure where the flexible circuit board and electronic components are enclosed within multiple protective layers. The inner fabric layer with foam padding nests the circuit board, which is further nested within the outer fabric layer. This nested configuration provides progressive protection at each layer while maintaining overall flexibility and enabling seamless integration into clothing fabrics.
Solution Approach 2:
The device utilizes a composite structure combining fabric layers, foam padding, flexible circuit boards, and adhesive layers. Each material contributes specific properties: fabric provides flexibility and clothing integration, foam provides cushioning and structural support, flexible circuit board provides electrical functionality, and adhesive provides bonding. Together, these composite materials achieve both protection and flexibility simultaneously.
3Reliability
If multiple protective layers and padding are added to protect the circuit board, then device protection is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent merges multiple functional layers into an integrated assembly where the outer fabric layer, inner fabric layer, foam padding, flexible circuit board, and adhesive layers are combined into a single cohesive unit. The adhesive layers bond these components together, creating a pre-assembled protective enclosure that reduces manufacturing complexity by treating the multi-layer structure as an integrated component rather than separate parts requiring complex assembly procedures.
Data Source
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AI summary
A wearable monitoring device includes printed circuit board having a first side and a second side opposite the first side, wherein the printed circuit board is configured to couple to at least one sensor configured to monitor a physiological condition; at least a first padding layer coupled to the printed circuit board proximate the first side; at least a second padding layer coupled to the printed circuit board proximate the second side; a first protective layer coupled to the first padding layer opposite the printed circuit board; a second protective layer coupled to the second padding layer opposite the printed circuit board; at least one additional layer between the first protective layer opposite the printed circuit board; the first protective layer and the second protective layer seal together and enclose the first and second padding and the printed circuit board; and a power source coupled to the printed circuit board.