Flexible Panel Restraining Component for Thermal Stress Management
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Solution Overview
Problem
Flexible displays fabricated on flexible substrates face issues with thermal stress due to large coefficient of thermal expansion, leading to broken conductive bumps and disrupted electrical connections when removed from rigid substrates, as the flexible substrates expand or contract with temperature variations.
Innovation Solution
A flexible device with a restraining component of higher rigidity and lower thermal expansion coefficient is introduced, positioned adjacent to the driver bonding region, to mitigate thermal contraction and ensure stable electrical connections by restraining the flexible panel's expansion or contraction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the flexible substrate is adhered to the rigid substrate and then removed after fabrication, then the flexible display panel can be formed, but the flexible substrate contracts significantly due to thermal stress release, causing conductive bumps to peel off or break
Solution Approach 1:
The patent introduces a restraining component with specific rigidity and coefficient of thermal expansion parameters that differ from the flexible substrate. This component changes the thermal expansion characteristics of the overall structure, compensating for the flexible substrate's contraction during temperature variations and preventing conductive bump failure.
Solution Approach 2:
The restraining component acts as an intermediary element between the flexible substrate and the external environment. It mediates the thermal stress by providing mechanical restraint, absorbing the contraction forces that would otherwise directly affect the conductive bumps and electrical connections.
2Ease of manufacture
If the flexible substrate undergoes temperature variations during bonding and subsequent processes, then the fabrication can be completed, but the flexible substrate expands or contracts, negatively impacting electrical connections
Solution Approach 1:
The restraining component is designed and positioned in advance during the fabrication process, before temperature variations occur. It is pre-configured to provide continuous mechanical restraint throughout subsequent bonding and manufacturing steps, ensuring electrical connections remain stable despite thermal expansion and contraction of the flexible substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The restraining component effectively prevents significant contraction of the flexible panel, maintaining electrical connections and ensuring the drivers function properly, enhancing the electrical properties and yield of the flexible device.
Implementation Method 1
coefficient of thermal expansion of the restraining component is smaller than coefficient of thermal expansion of the flexible panel
Implementation Method 2
the flexible substrate is contracted to a great extent, and the stress is released
Data Source
AI summary
A flexible device has a flexible panel, a driver, and a restraining component. The flexible panel includes a main region and a driver bonding region outside the main region. The driver is electrically connected to the driver bonding region. The restraining component is disposed adjacent to the driver bonding region. Rigidity of the restraining component is greater than rigidity of the flexible panel, and coefficient of thermal expansion of the restraining component is smaller than coefficient of thermal expansion of the flexible panel.