Flexible Patch Antenna Module for Low-Loss Millimeter-Wave Links

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Solution Overview

Problem

Millimeter wave communications, such as 5G, face significant signal loss due to absorption of radio frequency signals in high frequency bands, leading to deteriorated communication quality, which requires specialized antenna technologies to maintain effective isotropic radiated power and antenna gain.

Innovation Solution

The antenna module comprises a combination of first and second patch antenna units with dielectric layers and flexible substrates, along with an integrated circuit, to reduce transmission loss and enhance signal gain by optimizing the electrical length and dielectric constants, allowing for flexible placement and reduced external interference.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If millimeter wave communications are used to support high data traffic, then communication capacity and speed are improved, but signal loss increases due to absorption of radio frequency signals in high frequency bands

Engineering Contradiction:
Improvecommunication capacityVSAvoidsignal loss
Core Design Contradiction:
ProductivityVSLoss of energy

Solution Approach 1:

The patent changes the physical parameters of the antenna system by using multiple patch antenna elements with specific geometric configurations and dielectric layer arrangements. This optimizes the radiation pattern and gain characteristics to compensate for signal loss in millimeter wave bands, enabling effective high-capacity communication despite the inherent absorption losses at these frequencies

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent employs composite structures combining multiple dielectric layers with different properties, metal patch elements, and substrate materials. This composite approach creates an antenna system with optimized electromagnetic characteristics that enhances signal propagation efficiency in high frequency bands, reducing the impact of signal absorption and maintaining communication quality

Inventive Principle:
Principle #40Composite materials

2Reliability

If separate power amplifiers and special technological development are implemented to secure antenna gain, then communication quality is improved, but device complexity and cost increase

Engineering Contradiction:
Improvecommunication qualityVSAvoiddevice complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent integrates multiple antenna elements and functional components into a unified antenna module structure. By combining the patch antenna elements, dielectric layers, and feeding networks into a single integrated design, the system achieves the required antenna gain and communication reliability without requiring separate power amplifiers or additional complex subsystems, thereby reducing overall device complexity

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration improves the efficiency of RF signal transmission and reception by reducing loss and increasing gain, enabling effective communication in high-frequency bands while minimizing size and interference from external obstacles.

Implementation Method 1

at least one first dielectric layer surrounding the at least one first feed via; at least one second dielectric layer surrounding the at least one second feed via

Methodology Applied
Scientific EffectDielectric: Dielectric

Data Source

PatentUS11967752B2Antenna module and electronic device including the same
Publication Date: 2024.04.23 SAMSUNG ELECTRO MECHANICS CO LTD
  • US11967752B2 patent drawing
  • US11967752B2 patent drawing
  • US11967752B2 patent drawing

AI summary

An antenna module includes a first antenna unit including at least one first patch antenna pattern, at least one first feed via, and at least one first dielectric layer, a second antenna unit including at least one second patch antenna pattern, at least one second feed via, and at least one second dielectric layer, a first connection portion, a first rigid substrate electrically connecting the first connection portion to the first antenna unit and having a first surface on which the first antenna unit is disposed, a base connection portion, a flexible substrate having a first surface on which the first connection portion is disposed and a second surface on which the base connection portion is disposed, and an IC electrically connected to the flexible substrate through the second surface of the flexible substrate or the first rigid substrate.