Flexible Conductive Pattern Layout for Bend-Resistant Displays
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Solution Overview
Problem
Flexible electronic devices face increased damage from deformation stresses, particularly in conductive patterns and brittle material layers, leading to cracking and malfunction due to higher consumer demands for flexibility.
Innovation Solution
The design of conductive patterns with specific angle orientations and material compositions, such as using metals with good ductility and varying shapes, along with a multilayer structure, to minimize stress and prevent cracking during bending.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If flexible electronic devices are designed to be bendable, then adaptability and versatility are improved, but reliability deteriorates due to increased deformation stress causing cracking and damage
Solution Approach 1:
The patent applies local quality by designing conductive patterns with varying shapes (first part and second part with different geometries) and orientations in different regions of the flexible display device. This allows each region to have optimized stress distribution characteristics tailored to its specific location and deformation requirements, thereby maintaining reliability while enabling flexibility.
Solution Approach 2:
The patent employs composite materials by combining conductive patterns made of different materials (such as metal traces with varying ductility) with the flexible substrate and encapsulation layers. This composite structure allows the device to withstand deformation stresses better while maintaining electrical conductivity and flexibility.
2Manufacturing precision
If conductive patterns are made with standard uniform designs, then manufacturing precision is maintained, but reliability deteriorates due to stress concentration during bending
Solution Approach 1:
The patent implements local quality by introducing variations in conductive pattern geometry (different shapes for first and second parts) and orientations in specific regions. This allows stress distribution to be optimized locally at high-stress areas while maintaining overall manufacturing precision through controlled variation rather than complete uniformity.
Solution Approach 2:
The patent applies parameter changes by modifying the shape parameters and orientation angles of conductive patterns in different regions. By changing these geometric parameters locally, the design accommodates deformation stresses better while maintaining manufacturing feasibility through systematic parameter variation.
3Manufacturing precision
If brittle material layers are used in flexible displays, then manufacturing precision and material properties are maintained, but reliability worsens due to increased probability of breaking under deformation stress
Solution Approach 1:
The patent applies local quality by designing the conductive patterns with varying shapes and orientations that specifically address stress concentration points in brittle material layers. This local optimization protects vulnerable regions while maintaining the overall quality and manufacturing precision of the material layers.
Solution Approach 2:
The patent implements beforehand cushioning by designing conductive patterns with appropriate shapes and orientations prior to deformation, which preemptively reduce stress concentration on brittle material layers. This preventive design approach cushions the brittle layers against potential breaking during subsequent bending operations.
Data Source
AI summary
An electronic device includes a plurality of light-emitting units disposed on a substrate, an encapsulation layer disposed on the substrate, and a plurality of patterns disposed on the substrate. Wherein at least one of the plurality of patterns includes a first part and a second part, and the first part and the second part are different in shape.