Flexible Light-Emitting Pattern Layout for Bend-Induced Stress
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Solution Overview
Problem
Flexible electronic devices face increased damage risk due to deformation stresses, particularly in conductive patterns and brittle material layers, which can lead to cracking and malfunction.
Innovation Solution
The design of conductive patterns with specific angle orientations and materials, such as gold, silver, copper, and aluminum, along with multilayer structures, to minimize stress and prevent cracking during bending.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If flexible electronic devices are bent to achieve deformability, then adaptability and versatility are improved, but deformation stress increases the probability of damage to conductive patterns and brittle material layers
Solution Approach 1:
The patent employs flexible thin film structures for the encapsulation layer and conductive patterns that can accommodate bending deformations without cracking. The thin film design allows the device to be bent while maintaining structural integrity and preventing damage to conductive patterns and brittle material layers.
Solution Approach 2:
The patent uses composite material structures combining different layers with complementary properties - flexible substrate, light-emitting units, encapsulation layer, and conductive patterns with varying lengths. This composite structure distributes deformation stress across different materials, preventing concentration of stress at single points and reducing damage probability during bending.
2Manufacturing precision
If conductive patterns are made longer to cover more light-emitting units, then manufacturing precision is improved, but stress concentration increases during bending
Solution Approach 1:
The patent applies local quality by making conductive patterns of different lengths according to their specific positions and functions. Not all conductive patterns are made uniformly long - each pattern's length is optimized for its local requirements, providing sufficient coverage for manufacturing precision while avoiding excessive length that would cause stress concentration during bending.
Solution Approach 2:
The conductive patterns are segmented into multiple discrete elements rather than continuous long traces. This segmentation breaks up stress pathways and prevents stress concentration along entire pattern lengths, while still achieving adequate coverage of light-emitting units through strategic placement of multiple shorter pattern segments.
Data Source
AI summary
An electronic device includes a substrate, a plurality of light-emitting units, an encapsulation layer and a plurality of patterns. The plurality of light-emitting units are disposed on the substrate. The encapsulation layer is disposed on the plurality of light-emitting units. The plurality of patterns are disposed on the encapsulation layer, overlap with at least a portion of the plurality of light-emitting units, and overlap with at least a portion of the encapsulation layer. In a top view of the electronic device, a first part of the plurality of patterns and a second part of the plurality of patterns are different in length.