Flexible Printed Circuit Board Anti-EMI Layer Manufacturing
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Solution Overview
Problem
The existing manufacturing methods for flexible printed circuit boards with anti-electromagnetic interference (EMI) structures face challenges in reducing thickness and production cost due to the excessive thickness caused by solid-state formed layers and the necessity of adhesive layers.
Innovation Solution
A method involving the liquefaction and coating of flexible insulating and metal materials, followed by solidification to form thin layers, eliminating the need for adhesive layers and reducing the overall thickness and material consumption of the flexible printed circuit board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If solid-state formed layers are used for insulating and anti-EMI layers, then the structural integrity is maintained, but the thickness becomes excessive and cannot meet the height limit requirements
Solution Approach 1:
The patent changes the physical state of the insulating material from solid to liquid during the coating process, allowing for precise thickness control through liquid coating methods. The liquid insulating material is coated in a liquefied state and then solidified, enabling thickness to be controlled at the molecular level rather than through mechanical bonding of solid layers, thus achieving thickness less than 10 μm while maintaining structural integrity.
Solution Approach 2:
The patent replaces the mechanical attachment process with a chemical bonding process. Instead of mechanically bonding solid insulating layers and anti-EMI layers with adhesive layers, the liquid insulating material is coated directly onto the conductive layer and solidified to form a chemically bonded structure, eliminating the need for separate adhesive layers and achieving thinner overall thickness.
2Strength
If adhesive layers are used to bond solid-state formed layers, then the structural integrity is maintained, but the overall thickness increases and production cost rises
Solution Approach 1:
The patent merges the functions of the insulating layer and adhesive layer into a single integrated structure. The liquid insulating material serves both as the insulating barrier and as the bonding medium, eliminating the need for separate adhesive layers. This merging reduces the overall thickness while maintaining bonding strength through direct chemical bonding between layers.
Solution Approach 2:
The patent extracts and eliminates the separate adhesive layer from the traditional multi-layer structure. By using liquid insulating material that can chemically bond to both the conductive layer and the anti-EMI layer, the adhesive layer function is integrated into the insulating layer itself, reducing overall thickness and material cost.
3Object-affected harmful factors
If multiple solid-state layers are attached together, then the EMI shielding function is achieved, but the production cost increases due to material consumption and process complexity
Solution Approach 1:
The patent changes the state of the insulating material to liquid for the coating process, enabling thin-film deposition with precise thickness control. This parameter change allows the anti-EMI layer to be formed as a thin liquid-coated layer that solidifies in place, reducing material consumption while maintaining EMI shielding effectiveness, thereby lowering production cost.
Solution Approach 2:
The patent uses liquid coating methods (hydraulic principle) to deposit the insulating and anti-EMI layers. The liquid material is coated in a liquefied state, allowing for uniform thin-film formation through fluid dynamics control, which reduces material waste and enables more efficient production processes compared to traditional solid-state lamination methods.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a reduced thickness and lower production costs for flexible printed circuit boards with improved quality by controlling the thickness of the insulating and anti-EMI layers to be less than 10 μm and 18 μm respectively, while maintaining effective EMI shielding.
Implementation Method 1
coating a liquefied flexible insulating material over the printed circuit, and solidifying the liquefied flexible insulating material to form a flexible insulating layer
Implementation Method 2
coating a liquefied metal material over the flexible insulating layer, and solidifying the liquefied metal material to form an anti-electromagnetic interference (anti-EMI) layer
Data Source
AI summary
A manufacturing method for flexible printed circuit board is provided, in which a flexible insulating material and a metal material are liquefied and the liquefied materials are coated and solidified to form a flexible insulating layer and an anti-EMI layer of an anti-EMI structure, respectively. As such, an adhesive layer can be eliminated and the thickness of the flexible insulating layer and the anti-EMI layer can be reduced and an amount of materials consumed is also reduced, resulting in reduction of production cost, reduction of thickness of the flexible printed circuit board with anti-EMI structure, and improved quality.