Flexible PCB Backlight Unit Heat Dissipation via Through-Hole Adhesive
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Solution Overview
Problem
Conventional backlight units with metal core printed circuit boards are thick, heavy, and costly, and they inefficiently release heat generated by high-output LEDs, leading to reduced product efficiency and potential malfunctions.
Innovation Solution
A backlight unit utilizing a flexible printed circuit board with through holes and a reinforcement plate, where the LED package is directly connected to a metallic bottom plate via a heat conducting adhesive, allowing for efficient heat transfer and reduced thickness and weight.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a metal core printed circuit board is used to transfer heat from the LED, then heat release efficiency is improved, but the backlight unit becomes thicker and heavier
Solution Approach 1:
The patent extracts the heat dissipation function from the traditional metal core PCB structure and implements it through a dedicated heat dissipation plate with thermal conductive adhesive, allowing the PCB to be thinner while maintaining effective heat transfer from the LED to the heat dissipation plate and then to the housing
Solution Approach 2:
The patent introduces a separate heat dissipation plate layer between the LED and the housing, creating an additional dimensional path for heat transfer that is independent of the PCB thickness, thereby enabling efficient heat dissipation without increasing the overall backlight unit thickness
2Temperature
If a metal core printed circuit board is used to transfer heat from the LED, then heat release efficiency is improved, but the backlight unit becomes heavier
Solution Approach 1:
The patent separates the heat dissipation function from the heavy metal core PCB structure and implements it through a dedicated heat dissipation plate with thermal conductive adhesive, allowing the PCB to be lighter while maintaining effective heat transfer from the LED to the heat dissipation plate and then to the housing
Solution Approach 2:
The patent introduces a separate heat dissipation plate layer between the LED and the housing, creating an additional dimensional path for heat transfer that is independent of the PCB weight, thereby enabling efficient heat dissipation without increasing the overall backlight unit weight
3Reliability
If a conventional PCB structure is used, then electrical connection is achieved, but heat dissipation efficiency is reduced
Solution Approach 1:
The patent segments the heat dissipation function from the electrical connection function by introducing a dedicated heat dissipation plate and thermal conductive adhesive layer, allowing the PCB to maintain its electrical connection role while the separate heat dissipation structure handles thermal management efficiently
Solution Approach 2:
The patent introduces a thermal conductive adhesive as an intermediary substance between the LED and the heat dissipation plate, enabling efficient heat transfer while maintaining reliable electrical connections through the PCB's separate conductive paths
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The flexible printed circuit board design results in a slimmer, lighter, and more cost-effective backlight unit with enhanced heat transfer efficiency, reducing the overall thickness and weight while improving heat dissipation.
Implementation Method 1
a heat conducting adhesive formed in the through hole to connect an underside surface of the LED package with a top surface of the bottom plate
Data Source
AI summary
A backlight unit includes a flexible printed circuit board having a least one through hole perforated therein, and an LED package disposed on a top portion of the flexible printed circuit board corresponding to the through hole. The LED package is directly bonded onto a bottom plate by a heat conductive adhesive.