Flexible PCB Overlap and Branching for Compact Wearable Electronics
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Solution Overview
Problem
Electronic devices, such as head-mounted displays, face challenges in providing a compact design with sufficient mounting space for components due to limited space within a wearable housing, and the need to minimize the space occupied by electrical structures.
Innovation Solution
The use of a flexible printed circuit board (FPCB) configuration with overlapping and branching connections between PCBs, reducing the space required for connectors and allowing for a more compact design while increasing mounting area flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the housing area is limited to achieve compact wearable design, then the device becomes more compact and comfortable to wear, but the mounting area for components is reduced
Solution Approach 1:
The patent transitions from a planar PCB layout to a three-dimensional stacked configuration where multiple PCBs are arranged vertically. This allows the mounting area to be distributed across multiple layers rather than confined to a single plane, effectively increasing the available mounting space within the same footprint area. The first and second PCBs are positioned at different heights, enabling component mounting in the vertical dimension as well as horizontal dimensions.
Solution Approach 2:
The patent implements a nested structure where the second PCB is positioned beneath the first PCB, creating a stacked arrangement. This nesting allows multiple circuit boards to occupy the same spatial envelope, with the second PCB serving as a foundational layer and the first PCB layered above it. This nested configuration maximizes space utilization by placing multiple functional layers within a compact vertical profile.
2Reliability
If traditional rigid PCB connections are used, then electrical connection reliability is maintained, but the space occupied by connectors and electrical structures increases
Solution Approach 1:
The patent employs flexible printed circuit boards (FPCBs) to replace traditional rigid PCB connections between the first and second PCBs. The FPCB provides a flexible electrical interconnect that can accommodate the vertical stacking arrangement while maintaining reliable electrical connections. This flexible approach eliminates the need for bulky rigid connectors and allows for more compact overall device dimensions.
Solution Approach 2:
The patent transitions from planar electrical connections to three-dimensional vertical stacking, where the FPCB serves as a flexible bridge between PCB layers. This dimensional change allows electrical structures to be distributed vertically rather than requiring extensive horizontal connector spaces, reducing the overall volume occupied by electrical infrastructure while maintaining connection reliability.
Data Source
AI summary
An electronic device includes a frame, a housing including a first temple connected to one side of the frame and a second temple connected to an opposite side of the frame, a first printed circuit board (PCB) located in the first temple, a first flexible printed circuit board (FPCB) electrically connected to the first PCB, and a second FPCB electrically connected to the first PCB. The first FPCB includes a first overlapping portion that is extracted from the first PCB in a first direction and overlaps the second FPCB. The first FPCB further includes a first branch that extends from the first overlapping portion and does not overlap the second FPCB. The second FPCB includes a second overlapping portion that is extracted from the first PCB in the first direction and overlaps the first FPCB. The second FPCB further includes a second branch that extends from the second overlapping portion and does not overlap the first FPCB.