Flexible PCB Structure for Cleaning Flow in Storage Assemblies
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Solution Overview
Problem
The introduction of liquid into a storage device, such as a hard disk drive, can lead to the accumulation of liquid and flux in the gap between the flexible printed circuit (FPC) board and the electronic component, hindering the flow of cleaning liquids and potentially causing contamination.
Innovation Solution
The FPC board is designed with a specific structure that includes a base layer, conductive layers, and adhesive layers, along with reinforced plates that enhance rigidity and support the connection points, allowing for efficient flow and discharge of cleaning liquids through enlarged spaces and gaps, ensuring effective removal of contaminants.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the FPC board is mounted closely to the electronic component to reduce device size, then the device compactness is improved, but the gap between FPC and electronic component is reduced which hinders liquid flow and causes contamination
Solution Approach 1:
The FPC board structure is segmented into multiple functional layers (base layer, first conductive layer, second conductive layer, adhesive layer) with specific gaps between layers. This segmentation creates controlled spaces that allow liquid flow while maintaining compact overall device size, resolving the contradiction between compactness and liquid accessibility.
Solution Approach 2:
The patent introduces a vertical dimensionality with the second conductive layer positioned above the first conductive layer, creating a three-dimensional structure. This vertical arrangement enables liquid to flow through the gaps between layers in the vertical direction, maintaining compact horizontal footprint while ensuring adequate liquid access for contamination removal.
2Object-affected harmful factors
If cleaning liquid is introduced to remove flux and contaminants, then the cleanliness is improved, but liquid and flux may accumulate in the gap between FPC and electronic component, causing residual contamination
Solution Approach 1:
The patent replaces reliance on gravity-driven liquid drainage with a structured gap design that facilitates active liquid removal. The controlled gaps between FPC layers and between FPC and electronic component create defined flow paths that enable complete liquid evacuation through capillary action and pressure-driven flow, preventing residual contamination.
Solution Approach 2:
The FPC board structure functions as a controlled porous system with intentional gaps between layers and components. These gaps act as fluid channels that allow cleaning liquid to penetrate deep into the assembly and be completely removed, preventing flux and contaminant accumulation in enclosed spaces.
3Ease of manufacture
If the FPC board structure is simplified to reduce manufacturing complexity, then the ease of manufacture is improved, but the structural integrity and rigidity may be compromised
Solution Approach 1:
The FPC board employs a composite structure combining base layer, conductive layers, and adhesive layer. This composite design provides enhanced structural rigidity and mechanical strength compared to single-layer constructions, while the standardized layering process maintains manufacturing simplicity. The adhesive layer specifically bonds components together, ensuring structural integrity.
Data Source
AI summary
A flexible printed circuit board of a storage device includes a first insulating layer, a first conductive layer on a first surface of the first insulating layer, and a second conductive layer on a second surface of the first insulating layer. The second surface is opposite the first surface. The first conductive layer is provided with a land. The second conductive layer covers the land via the first insulating layer in a first direction in which the first surface faces. An electronic component of the storage device includes a pin joined to the land.